MEMS Package with Bond Seal Ring Hole for Multi-Pressure Integration
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Solution Overview
Problem
Conventional MEMS packages are complicated and have a large footprint due to the need for separate packaging of MEMS devices at different pressures, which complicates the integration process.
Innovation Solution
Incorporating a hole in the bond seal ring for pressure adjustment in the cavity after bonding and forming an anti-stiction coating layer during the pressure adjustment process, allowing for the integration of MEMS devices with different pressures in a single package while simplifying the packaging process and reducing the package footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If MEMS devices requiring different pressures are packaged separately at different ambient pressure, then each device can be packaged at its required pressure, but the whole packaging process becomes complicated and the package footprint becomes large
Solution Approach 1:
The patent merges multiple packaging processes into a single unified process. Multiple MEMS devices requiring different pressures are packaged simultaneously in one package structure, eliminating the need for separate packaging operations. The bond seal ring with integrated hole structure enables this combined approach, where all devices are sealed together after a single bonding operation.
Solution Approach 2:
The patent performs preliminary pressure adjustment by forming a hole in the bond seal ring before final sealing. This allows pressure to be adjusted in the cavity at a controlled stage of the process, enabling different pressure requirements to be met while maintaining a simplified single-step packaging approach. The hole is formed in advance to facilitate subsequent pressure equalization or adjustment.
2Reliability
If MEMS devices requiring different pressures are packaged separately at different ambient pressure, then each device can be packaged at its required pressure, but the package footprint becomes large
Solution Approach 1:
The patent combines multiple individually packaged devices into a single integrated package. By sealing multiple MEMS devices together in one package with a unified bond seal ring structure, the total footprint is reduced compared to having separate packages for each device. The shared bonding and sealing infrastructure eliminates redundant packaging materials and space.
3Reliability
If a hole is formed in the bond seal ring for pressure adjustment after bonding, then pressure can be adjusted in the cavity, but the bonding process becomes more complex
Solution Approach 1:
The hole is formed in the bond seal ring before the bonding operation takes place. This preliminary formation of the hole structure allows the bonding process itself to remain simple and uninterrupted, while still enabling subsequent pressure adjustment. The hole is prepared in advance as part of the bond seal ring fabrication, so it does not complicate the actual bonding step.
Data Source
AI summary
A micro-electro-mechanical system (MEMS) package includes a wafer with an interconnect layer disposed thereon. A first device substrate including a first MEMS device and a second device substrate including a second MEMS device are laterally spaced apart from each other and disposed on the wafer. A first and a second bond seal rings are disposed below the first and the second device substrates, respectively, and both bonded to the interconnect layer. A first handle substrate includes a first cavity having a first pressure, and is bonded to the first device substrate. A second handle substrates includes a second cavity having a second pressure different from the first pressure, and is bonded to the second device substrate. A hole is disposed in the second bond seal ring for pressure adjustment in the second cavity.