MEMS Cap Element Shaping via Differential Thermal Deformation
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Solution Overview
Problem
Existing methods for producing composite cap elements for MEMS components, such as MEMS mirrors, face challenges in achieving high-precision shaping, alignment, and bonding of transparent elements, while also requiring efficient and scalable production processes that minimize reprocessing steps.
Innovation Solution
A process involving a base substrate with a window and a transparent cover substrate with different softening temperatures, where a hermetic bond is created between the substrates, and the bonded substrates are heated to allow deformation of the base substrate while maintaining the cover substrate's dimensional stability, enabling the formation of a composite cap element with high precision and optical quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding methods are used for transparent elements, then bonding can be achieved, but manufacturing precision and alignment precision deteriorate
Solution Approach 1:
The patent applies parameter changes by utilizing the temperature-dependent viscosity differences between the base substrate and cover substrate. By heating to a specific temperature range, the base substrate becomes deformable while the cover substrate remains dimensionally stable, enabling precise shaping and alignment without complex repositioning steps.
Solution Approach 2:
The patent implements preliminary action by creating the hermetic bond between substrates before performing the deformation step. This sequence ensures that the substrates are securely connected prior to shaping, preventing misalignment and maintaining bonding precision throughout the deformation process.
2Manufacturing precision
If multiple process steps are used for high precision, then manufacturing quality improves, but productivity deteriorates
Solution Approach 1:
The patent merges multiple operations into a single integrated process step. By combining bonding, heating, and deformation into one continuous sequence where the base substrate is deformed while already bonded to the cover substrate, the method eliminates separate repositioning and alignment steps, thereby maintaining high precision while improving productivity.
3Shape
If the cover substrate is deformed along with the base substrate, then shaping is achieved, but the cover substrate's dimensional stability and optical quality deteriorate
Solution Approach 1:
The patent applies local quality by creating a differential response to thermal processing across different substrates. The base substrate is designed to become deformable at the processing temperature, while the cover substrate maintains its dimensional stability and optical properties, allowing localized shaping without compromising overall optical quality.
Solution Approach 2:
The patent utilizes composite materials with different thermal and mechanical properties. The base substrate and cover substrate are made from materials having different softening temperatures and viscosity characteristics, enabling the base substrate to be deformed while the cover substrate remains stable, thus achieving complex housing geometries without degrading optical quality.
4Reliability
If hermetic bonding is implemented, then encapsulation quality improves, but the number of process steps increases
Solution Approach 1:
The patent implements preliminary action by establishing the hermetic bond between the base substrate and cover substrate before proceeding to the deformation step. This early bonding ensures that the encapsulation quality is secured upfront, and subsequent steps can proceed without additional bonding operations, thereby maintaining high reliability while minimizing process time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process achieves high-precision manufacture of composite cap elements with improved uniformity and optical quality, while reducing the number of process steps and enabling efficient, scalable production.
Implementation Method 1
The base substrate and the cover substrate have different softening temperatures, where the softening temperature of the base substrate is lower than the softening temperature of the cover substrate
Implementation Method 2
the mutually bonded substrates are heated to a temperature at which the base substrate reaches a viscosity of below 10^13 Pas, preferably to a temperature at which the base substrate reaches a viscosity of below 10^12 Pas
Implementation Method 3
the mutually bonded substrates are heated at least in an edge region of the window to a temperature at which the base substrate becomes deformable and the cover substrate remains dimensionally stable. In addition, the process comprises the moving of the dimensionally stable cover substrate in the region of the window with simultaneous deformation of the deformable base substrate
Data Source
AI summary
A method for producing a composite cap element for encapsulation of a MEMS component includes providing a base substrate having a window formed through an opening, providing a transparent cover substrate for transparently covering the window in the base substrate, producing a hermetic connection between the base substrate and the cover substrate in a connection region which extends peripherally around the window, heating the interconnected substrates in an edge region of the window to a temperature at which the base substrate becomes deformable and the cover substrate remains dimensionally stable, and displacing the dimensionally stable cover substrate in the region of the window while simultaneously deforming the deformable base substrate in a region around the window. A composite cap element is also provided.