MEMS Sensor Ceramic Carrier Mounting for Pipe Pressure
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Solution Overview
Problem
Traditional MEMS packaging systems are complex and costly due to the need for multiple hermetic seals and are prone to thermal mismatch issues, which can compromise the integrity of the seals over time, especially in harsh environments.
Innovation Solution
A MEMS system that uses a ceramic substrate with a metal port aligned with an opening, where the backside of the MEMS device is hermetically sealed to one side of the substrate, and a non-metallic housing encloses the device on the other side, eliminating the need for a metal housing and reducing the number of seals and thermal mismatch risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal housing with multiple hermetic seals is used to protect the MEMS device, then the device is protected from harsh environments, but the complexity of manufacturing increases and thermal mismatch issues arise
Solution Approach 1:
The patent removes the metal housing from the packaging system, extracting the source of thermal mismatch and manufacturing complexity. The MEMS device is mounted directly to a ceramic substrate with a single hermetic seal, eliminating the intermediate metal housing component and its associated sealing requirements.
Solution Approach 2:
The patent uses a ceramic substrate as the mounting platform for the MEMS device. Ceramic materials provide both mechanical support and hermetic sealing properties, combining multiple functions into a single material that reduces overall system complexity while maintaining protection from harsh environments.
2Reliability
If multiple hermetic seals are used to ensure leak-free operation, then the integrity of the packaging is improved, but the cost of manufacturing increases
Solution Approach 1:
The patent eliminates two of the three hermetic seals found in traditional packaging by removing the metal housing. Only one hermetic seal remains between the ceramic substrate and the mounting flange, significantly reducing sealing requirements and associated manufacturing costs while maintaining leak-free operation.
3Adaptability or versatility
If a die pad with flange and metal housing are used to provide mounting interface, then the MEMS device can be coupled to larger system, but the number of hermetic seals increases
Solution Approach 1:
The patent combines the mounting flange function and hermetic sealing function into a single ceramic substrate component. The ceramic substrate serves as both the mounting platform for the MEMS device and the hermetic barrier, eliminating the need for a separate metal housing while maintaining system adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the packaging process, reduces costs, and enhances the reliability of MEMS systems by minimizing the number of hermetic seals and thermal mismatch issues, while allowing direct mounting to pipes or other structures for in-stream measurements.
Implementation Method 1
the backside of the MEMS device is hermetically sealed to a first side of the ceramic substrate around the opening
Data Source
AI summary
Systems and methods for packaging a MEMS device to measure the in-stream pressure within a pipe are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, the MEMS device is mounted directly to the pipe using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal pipe.