MEMS Chip Ceiling Mounting for Stress Isolation
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Solution Overview
Problem
Mechanical stress from a printed circuit board (PCB) is easily transmitted to MEMS components, degrading their performance by misorienting the MEMS chip, which affects the accuracy of measurements.
Innovation Solution
Mounting the MEMS chip on the ceiling of the enclosure within a ceramic package structure, rather than the conventional floor, to reduce the transmission of mechanical stress and maintain accurate orientation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the MEMS chip is mounted on the floor of the enclosure, then the component structure is conventional and easy to manufacture, but mechanical stress from the PCB is easily transmitted to the MEMS chip, degrading measurement accuracy
Solution Approach 1:
The patent inverts the conventional mounting arrangement by placing the MEMS chip on the ceiling of the enclosure instead of on the floor. This inversion changes the stress transmission path: mechanical stress from the PCB is now transmitted to the floor first, then to the sidewalls, and only indirectly to the MEMS chip on the ceiling, thereby isolating the sensitive MEMS chip from direct stress and improving measurement accuracy
2Reliability
If the MEMS chip is mounted on the ceiling of the enclosure, then mechanical stress transmission is reduced and measurement accuracy is maintained, but the component structure becomes non-conventional and more complex to manufacture
Solution Approach 1:
The patent applies inversion by mounting the MEMS chip on the ceiling rather than the floor, achieving reliable performance consistency by isolating the chip from stress. The manufacturing complexity is managed by using standard ceramic package structures with modified internal mounting surfaces, where the ceiling is equipped with appropriate bonding pads and mechanical attachment features
Solution Approach 2:
The patent introduces the enclosure ceiling as an intermediary mounting surface between the MEMS chip and the stress-prone floor structure. This intermediary ceiling acts as a stress-isolating platform that maintains reliable chip performance while allowing the rest of the package structure to remain relatively simple and manufacturable
3Device complexity
If the MEMS chip is mounted on the floor of the enclosure, then the electrical connection path is short and simple, but the chip orientation is sensitive to PCB bending and mechanical stress
Solution Approach 1:
The patent inverts the mounting position from floor to ceiling, which stabilizes chip orientation by decoupling it from PCB bending stresses. The electrical connection path extends from the ceiling through the ceramic package structure to the bottom surface, maintaining acceptable complexity while achieving orientation stability
Data Source
AI summary
A device is provided that includes a MEMS chip and a housing forming an enclosure around the MEMS chip. The enclosure has a top and a bottom, the housing includes an upper unit, a lower unit and sidewalls which extend between the upper unit and the lower unit, the upper unit delimits the top of the enclosure, and the lower unit delimits the bottom of the enclosure, the lower unit or the sidewalls of the housing form an external bottom surface of the housing, the external bottom surface lies on a contacting side of the MEMS component, the housing further includes a ceramic package structure. The device includes the MEMS component and electrical connections that extend from the MEMS chip through the ceramic package structure to the contacting side of the MEMS component. The MEMS chip is mounted to the top of the enclosure.