MEMS Chip Package with Substrate Openings and Movable Bulks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current micro-electromechanical system (MEMS) chip packages are not optimized for smaller, lighter, and thinner electronic products, requiring a more efficient manufacturing method for smaller size and reduced fabrication costs.
Innovation Solution
A chip package design involving a substrate with openings and movable bulks, a protecting substrate with through-holes, and a conducting layer for electrical connection, allowing for wafer-scale packaging and enabling the formation of movable parts for light sensing or emitting devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional MEMS chip packaging methods are used, then manufacturing precision and device functionality are maintained, but fabrication cost and time increase, and device size cannot be reduced further
Solution Approach 1:
The substrate is divided into multiple movable bulks (first movable bulk, second movable bulk, etc.) separated by openings. Each movable bulk can be independently processed and functionalized, allowing parallel fabrication of multiple devices on a single wafer, thereby reducing overall fabrication time and cost while maintaining device precision through individual optimization
Solution Approach 2:
Multiple functional layers are combined into an integrated structure: the substrate, movable bulks, protecting substrate, and conducting layers are formed in a unified wafer-scale process. The conducting layer simultaneously provides electrical connection and structural support, merging multiple functions into single components to simplify manufacturing
2Volume of moving object
If device size is reduced for lighter and thinner electronic products, then portability is improved, but manufacturing complexity and fabrication difficulty increase
Solution Approach 1:
The patent transitions from three-dimensional bulk processing to two-dimensional wafer-scale planar processing. Multiple devices are fabricated simultaneously on a flat substrate with openings and movable bulks arranged in a planar configuration, enabling size reduction while maintaining manufacturing simplicity through standard semiconductor fabrication techniques
Solution Approach 2:
The substrate structure serves multiple functions simultaneously: it provides mechanical support, defines movable bulks through openings, enables electrical connections through conducting layers, and allows light transmission where needed. This multi-functionality reduces the number of separate components needed, simplifying manufacturing despite size reduction
Data Source
AI summary
A method for forming a chip package includes: providing a substrate having a first and a second surfaces; removing a portion of the substrate to form openings in the substrate, wherein the openings extend from the first surface towards the second surface or from the second surface towards the first surface; after forming the openings, at least a first portion of the substrate serves as a first movable bulk, and at least a second portion of the substrate serves as a second movable bulk, wherein the first movable bulk and the second movable bulk are respectively located between the openings; disposing a protecting substrate on the second surface of the substrate; forming a through-hole in the protecting substrate; and forming a conducting layer on the protecting substrate, wherein the conducting layer extends from a surface of the protecting substrate into the through-hole to electrically connect the second movable bulk.