MEMS Chip Post-Processing to Remove Projection Regions
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Solution Overview
Problem
Existing MEMS chips often have projection regions that reduce integration density and cause unwanted stray light and difficulty in configuring facet mirrors due to frame-like structures after protective covers are removed, especially at EUV wavelengths.
Innovation Solution
A method to remove projection regions by creating continuous gaps or predetermined breaking locations between the projecting material and the carrier material, using techniques like etching, thermal decomposition, or high-energy radiation, followed by handling MEMS chips through lateral depressions or engaging directly on MEMS structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective covers are applied to MEMS chips during production and handling, then mechanical protection and simplified handling are improved, but frame-like structures remain after cover removal that reduce integration density and cause stray light
Solution Approach 1:
The patent applies preliminary action by creating separation grooves and weakening structures in the carrier material before the protective cover is removed. This allows the frame-like structures to be easily eliminated after cover removal, preventing them from reducing integration density or causing stray light issues in the final MEMS chip array.
2Ease of operation
If projection regions are left on MEMS chips after protective cover removal, then handling is simplified, but stray light and integration density issues occur
Solution Approach 1:
The patent applies the extraction principle by completely removing the carrier material in projection regions after protective cover removal. This eliminates the frame-like structures that would otherwise generate stray light and reduce integration density, while the MEMS chip structures themselves remain intact and functional.
3Ease of operation
If carrier material extends beyond MEMS structures, then chip handling and alignment are improved, but uniform arrangement and control of facet mirrors become difficult
Solution Approach 1:
The patent applies segmentation by creating separate handling regions and functional regions on the MEMS chip. The carrier material is selectively removed in projection regions while maintaining it in handling regions, allowing independent optimization of alignment ease and configuration control for facet mirrors without mutual interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances integration density and reduces stray light by eliminating frame-like structures, facilitating uniform arrangement and control of MEMS chips, particularly in EUV photolithography applications.
Implementation Method 1
at least one projection region is removed by separating the projecting material from the carrier material of the MEMS chip
Implementation Method 2
the adhesive is thermally decomposed and the protective cover can be detached
Implementation Method 3
using techniques like etching, thermal decomposition, or high-energy radiation
Data Source
AI summary
In a method of post-processing MEMS chips comprising MEMS structures arranged on a carrier material and having at least one projection region of projecting material protruding laterally beyond the region of the MEMS chip provided with MEMS structures, at least one projection region is removed by separating the projecting material from the carrier material of the MEMS chip. For handling MEMS chips without regions projecting beyond the MEMS structures arranged on a carrier material, for example after post-processing according to the disclosure has been carried out, at least one lateral depression is provided in the carrier material and the MEMS chips are handled by way of a tool engaging in the lateral depression(s).