MEMS Chip Temperature Gradient Sensing via Radiometric Deflection
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Solution Overview
Problem
Existing temperature measurement methods for computer chips are elaborate, expensive, and only measure external temperatures, failing to accurately capture internal temperature gradients, which are crucial for assessing cooling capacity and are prone to measurement distortions due to thermal contact changes.
Innovation Solution
A micro-electro-mechanical sensor system that measures internal temperature differences or gradients within a chip or substrate using a movable structure in a sealed cavity, leveraging the radiometric effect to detect deflections capacitive-ly, with geometric asymmetries and gas pressure optimization to enhance precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are placed on a component to measure temperature, then temperature measurement is possible, but the measurement is elaborate, expensive, and only measures external temperature gradient not internal temperature gradient
Solution Approach 1:
The patent replaces traditional contact-based temperature sensors with a capacitive sensing system that measures temperature gradients through electrical field interactions. The movable structure's position changes in response to temperature-induced thermal expansion, and these changes are detected capacitively, eliminating the need for direct thermal contact and associated complexity.
Solution Approach 2:
The patent introduces a movable structure as an intermediary element between the temperature field and the measurement system. This movable structure responds to temperature changes through thermal expansion, converting thermal effects into mechanical displacement that can be measured capacitively, thereby indirectly measuring temperature without direct sensor contact.
2Measurement precision
If temperature sensors are placed on a component, then temperature can be measured, but thermal contacts of the temperature sensors may change over service life and distort measured values
Solution Approach 1:
The patent eliminates thermal contact interfaces by replacing contact-based temperature sensors with a capacitive measurement system. The movable structure responds to temperature changes without requiring thermal contact with the component, thus avoiding the reliability issues associated with thermal contact degradation over time.
Solution Approach 2:
The movable structure serves dual functions: it acts as both the sensing element that responds to temperature changes and the measurement target for the capacitive sensor. This self-contained approach eliminates the need for separate thermal contact sensors that would degrade over time.
3Measurement precision
If traditional temperature sensors are used, then external temperature gradient can be measured, but internal temperature gradient within the component cannot be measured
Solution Approach 1:
The movable structure serves as an intermediary that can be positioned within or near the component to measure internal temperature gradients. By placing the movable structure at different locations, the system can measure temperature gradients at multiple points including internal regions, providing both precision and versatility.
Solution Approach 2:
The patent transitions from measuring only external temperature gradients to measuring internal temperature gradients by positioning the movable structure within the component's thermal field. This adds a new dimension of measurement capability, moving from surface-level to internal temperature assessment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise measurement of internal temperature gradients, providing stable and accurate cooling capacity information by directly measuring within the chip or substrate, overcoming external measurement limitations and distortions.
Implementation Method 1
the measurement is based on the radiometric effect. A temperature difference between the substrate surface within the cavity and the movable structure situated opposite at a distance results in a measurable action of force or in a deflection of the movable structure
Data Source
AI summary
A sensor system. The sensory system includes a substrate extending in a substrate plane, a closed cavity and a movable structure in the closed cavity, at least one portion of the movable structure being situated at a distance opposite a surface of the substrate extending in parallel to the main extension plane within the cavity, the distance varying when the movable structure is deflected, a temperature difference between the surface of the substrate and the movable structure being measurable by an action of force on the movable structure.