3D MEMS-CMOS Stack for Compact CMUT Ultrasound Modules
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Solution Overview
Problem
Existing MEMS devices, particularly capacitive micromachined ultrasonic transducers (CMUTs), are bulky and costly due to the need for central processing units, frames, and wired components, limiting their portability and increasing system costs.
Innovation Solution
A semiconductor device with a three-dimensional vertical integration of MEMS components, including CMUTs, analog circuits, high-performance chips, deep trench capacitors, and printed circuit boards, allowing for compact and efficient ultrasound equipment by integrating these elements into a single, modular unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If MEMS devices are integrated with central processing units, frames, and wired components, then functional capability is improved, but device size and cost increase
Solution Approach 1:
The patent combines multiple discrete components (MEMS sensor, analog circuitry, digital signal processing, and communication interfaces) into a single integrated MEMS device structure. This merging eliminates the need for separate central processing units, frames, and wired components, thereby reducing device size while maintaining full functional capability through on-chip integration of sensing, processing, and communication functions.
Solution Approach 2:
The integrated MEMS device performs multiple functions within a single compact unit: it senses physical quantities, conditions analog signals, processes digital data, and enables wireless communication. This multi-functionality replaces what previously required separate specialized components, achieving both size reduction and functional versatility simultaneously.
2Extent of automation
If MEMS devices include central processing units and wired components, then processing capability is improved, but system cost increases
Solution Approach 1:
The patent integrates digital signal processing capabilities directly into the MEMS device architecture, combining what were previously separate processing units with the sensing element. This consolidation reduces the total component count and simplifies assembly, thereby lowering manufacturing costs while preserving advanced processing capability for automated signal analysis and control.
3Strength
If traditional MEMS devices use frames and wired components, then structural support is improved, but portability deteriorates
Solution Approach 1:
The patent eliminates traditional mechanical frames and wired connections by integrating all supporting structures and communication pathways directly into the MEMS device substrate. This integration removes bulky external components while maintaining structural integrity through monolithic device architecture, thereby achieving both structural support and enhanced portability.
Solution Approach 2:
The patent replaces mechanical frames and wired physical connections with integrated circuit pathways and on-chip structural supports. This substitution eliminates the need for heavy mechanical assemblies while maintaining structural strength through semiconductor fabrication techniques, thereby dramatically improving portability without sacrificing structural support capability.
Data Source
AI summary
A semiconductor device and method of forming such a device includes a MEMS component including one or more MEMS pixels and having a MEMS membrane substrate and a MEMS sidewall. The semiconductor device includes an analog circuit component bonded to the MEMS component, and which includes at least one analog CMOS component within an analog circuit insulative layer, and an analog circuit component substrate. The semiconductor device includes an HPC component bonded to the analog circuit component substrate. The HPC component includes at least one HPC metal component disposed within an HPC insulative layer, at least one bond pad, at least one bond pad via connecting the at least one bond pad and the at least one HPC metal component, and an HPC substrate. Additionally, the semiconductor device includes a DTC component bonded to the HPC substrate, and which includes a DTC die disposed in a DTC substrate.