MEMS-CMOS Module Direct PCB Mounting Height Reduction
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Solution Overview
Problem
MEMS devices, such as microphones, face challenges with increased height due to laminates and solder, leading to contamination and complex manufacturing processes.
Innovation Solution
A MEMS device with a MEMS-CMOS module directly mounted on a PCB, eliminating the need for laminates and solder by using an aperture in the PCB to expose the module to the environment, and potentially employing conformal coating for attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a laminate is used to build the MEMS and CMOS chip, then the structural integrity is improved, but the overall height of the microphone increases substantially
Solution Approach 1:
The patent removes the laminate layer from the traditional microphone structure, directly mounting the MEMS-CMOS module onto the PCB without requiring a laminate substrate. This extraction of the laminate eliminates the additional height (typically 0.25mm) while maintaining structural integrity through direct PCB mounting and soldering.
2Strength
If solder is used to connect the laminate to the PCB, then the mechanical connection is improved, but contamination is introduced into the microphone
Solution Approach 1:
The patent eliminates the laminate layer that requires soldering, thereby removing the source of solder contamination. By directly mounting the MEMS-CMOS module to the PCB without an intermediate laminate, the need for additional solder joints is reduced, minimizing contamination risks while maintaining adequate mechanical connection.
3Adaptability or versatility
If multiple manufacturers are used to build different components, then the specialization is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent integrates the MEMS chip and CMOS chip into a single MEMS-CMOS module that is mounted as one unit onto the PCB. This merging of previously separate manufacturing steps (building MEMS chip, CMOS chip, laminate, and assembly) into a single module reduces the number of manufacturers and assembly steps required, thereby simplifying the manufacturing process while maintaining component specialization within the integrated module.
Data Source
AI summary
A MEMS device includes a MEM-CMOS module having a CMOS chip and a MEMS chip. The MEMS chip includes a port exposed to the environment. The MEMS device further includes a printed circuit board (PCB) with an aperture, wherein the MEMS-CMOS module is directly mounted on the PCB.