3D Multi-Physics Design Environment for MEMS Co-Simulation
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Solution Overview
Problem
Current design and simulation tools for MEMS devices face challenges in effectively combining mechanical and electronic components, requiring time-consuming finite element meshing and limited ability to co-simulate MEMS and IC designs, leading to inefficiencies and errors in the design process.
Innovation Solution
A 3-D multi-physics design environment that allows for the creation of parameterized MEMS device models using behavioral models, enabling direct export to system modeling environments for circuit simulations without preliminary meshing, and facilitating co-simulation by integrating mechanical and electronic components in a single 3-D view.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional CAD/CAE and EDA tools are used separately for mechanical and electronic components, then each domain can be designed with specialized tools, but the integration of multi-physics systems becomes complex and time-consuming
Solution Approach 1:
The patent combines separate CAD/CAE tools for mechanical components and EDA tools for electronic components into a single integrated multi-physics design environment. This unified environment allows simultaneous design and simulation of mechanical, electrical, and other physics domains, eliminating the need for separate tools and reducing integration complexity.
Solution Approach 2:
The design environment provides universal functionality to handle multiple physics domains (mechanical, electrical, thermal, etc.) within a single platform. It can import various file formats (IGES, DXF, STEP, etc.) and perform different types of simulations (structural, electrical, fluid) without requiring separate specialized tools for each domain.
2Measurement precision
If finite element meshing is performed before circuit simulation, then accurate mechanical behavior can be captured, but the process becomes time-consuming and requires preliminary meshing steps
Solution Approach 1:
The system performs preliminary actions by automatically generating finite element models and conducting mechanical simulations before circuit simulation, but these steps are integrated and automated within the unified environment. The mechanical analysis results are automatically transferred to the circuit simulator without requiring manual meshing or separate preprocessing steps, thus maintaining accuracy while reducing time loss.
3Adaptability or versatility
If MEMS devices are designed with mechanical components only, then mechanical functionality can be achieved, but integration with electronic circuits for control and signal processing becomes difficult
Solution Approach 1:
The patent merges mechanical MEMS device models with electronic circuit models into a single co-simulation framework. The mechanical components (sensors, actuators) and electronic circuits (control logic, signal processing) are modeled together in the same environment, allowing automatic coupling of mechanical and electrical behaviors without requiring separate design processes.
4Productivity
If separate design environments are used for mechanical and electronic components, then each domain can be optimized independently, but errors and inefficiencies occur during integration
Solution Approach 1:
The integrated design environment provides continuous feedback between mechanical and electronic design aspects. Changes in mechanical component parameters automatically update the electrical model and vice versa, allowing designers to see the impact of modifications across different physics domains in real-time, thus maintaining both efficiency and accuracy.
Data Source
AI summary
A 3-D multi-physics design environment (“3-D design environment”) for designing and simulating multi-physics devices such as MEMS devices is discussed. The 3-D design environment is programmatically integrated with a system modeling environment that is suitable for system-level design and simulation of analog-signal ICs, mixed-signal ICs and multi-physics systems. A parameterized MEMS device model is created in a 3-D graphical view in the 3-D design environment using parameterized model components that are each associated with an underlying behavioral model. After the MEMS device model is completed, it may be exported to a system modeling environment without subjecting the model to preliminary finite element meshing.