MEMS Connection Line Structure for Compact 3D Flexible Wiring
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Solution Overview
Problem
Traditional flexible flat cables are bulky and inflexible, making them unsuitable for miniaturized electronic devices and complex three-dimensional structures, particularly in micro-electro-mechanical systems (MEMS) where smaller, more flexible signal transmission solutions are needed.
Innovation Solution
A connection line structure and forming method utilizing MEMS technology, comprising a passivation layer, metal layer, and protective layers, with metal lines that can be linear, wavy, or zigzag, and featuring welding plates at both ends, allowing for alternate stacking and flexible design, produced through semiconductor processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional flexible flat cables are used for signal transmission, then wiring is convenient and the number/spacing of wires can be selected, but the cable size is large and product miniaturization is limited
Solution Approach 1:
The patent transitions from planar flexible flat cables to three-dimensional MEMS structures. By stacking multiple metal layers (first metal layer, second metal layer, third metal layer) separated by dielectric layers and using vertical vias for inter-layer connections, the invention achieves signal transmission in multiple spatial dimensions, dramatically reducing the footprint and overall size of the cable assembly while maintaining wiring flexibility.
Solution Approach 2:
The patent implements a nested structure where multiple metal signal lines are embedded within stacked dielectric layers. The first, second, and third metal layers are nested within corresponding dielectric layers, with vias penetrating through dielectric layers to connect nested metal layers vertically, creating a compact multi-level integrated structure that reduces cable volume.
2Ease of operation
If traditional flexible flat cables are used, then signal transmission between PCBA and connector is achieved, but the cable structure is bulky and inflexible
Solution Approach 1:
The patent employs thin film structures typical of MEMS technology, where metal signal lines are deposited as thin films on substrates and stacked in multiple layers. This thin-film approach creates a flexible, miniaturized cable structure that can bend and conform to complex three-dimensional spaces, replacing the bulky traditional cable while maintaining flexibility for moving part connections.
Solution Approach 2:
The patent creates a dynamic, adaptable cable structure using MEMS technology that can be configured in various three-dimensional arrangements. The multi-layer metal structure with vias allows the cable to be routed through complex spatial paths and adapted to different connection geometries, providing operational flexibility for connecting moving parts and imaging modules in compact devices.
3Volume of moving object
If MEMS technology is used to produce connection lines, then the size can be reduced by 2 to 4 orders of magnitude, but the manufacturing process becomes more complex
Solution Approach 1:
The patent divides the connection line structure into segmented functional layers: first, second, and third metal layers for signal transmission, separated by first, second, and third dielectric layers. Each layer can be independently fabricated and optimized, allowing the complex MEMS manufacturing process to be broken down into manageable stages using standard semiconductor fabrication techniques.
Solution Approach 2:
The patent uses composite material structures combining multiple metal layers (different conductive materials) with dielectric layers (insulating materials). This composite approach allows optimization of each material layer for its specific function while maintaining compatibility with existing MEMS and semiconductor manufacturing processes, reducing overall manufacturing complexity despite the multi-layer structure.
Data Source
AI summary
Disclosed are a connection line structure and a forming method thereof. The connection line structure includes a passivation layer, a metal layer, and a protective layer, the metal layer is arranged on the passivation layer, and the protective layer is arranged on the metal layer. In the present application, a simple single-layer wiring design may be utilized, and a multi-layer three-dimensional wiring design may also be utilized to implement high speed transmission, a MEMS process allows for design of a connection line in a straight or bent layout, a connection line of a bent layout is flexible, and better compatibility is achieved.