MEMS Speaker Diaphragm with Corrugated Periphery
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Solution Overview
Problem
MEMS speakers experience signal distortion, particularly in the high frequency range, due to the flat shape of the movable diaphragm causing resonance issues and varying oscillation amplitudes across frequencies.
Innovation Solution
A semiconductor device with a movable diaphragm featuring a central flat region and a corrugated peripheral region, where the corrugated portion acts as a dampening element to reduce oscillation variations across frequencies, thereby minimizing signal distortion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat movable diaphragm is used in MEMS speakers, then the manufacturing process is simple, but signal distortion occurs in the high frequency range due to resonance issues and varying oscillation amplitudes
Solution Approach 1:
The movable diaphragm is designed with different shapes in different regions: a flat central region and a corrugated peripheral region. This local differentiation allows the central region to maintain simplicity while the peripheral region provides resonance control to reduce signal distortion in the high frequency range.
Solution Approach 2:
The corrugated peripheral region introduces curved geometric features (ridges and grooves) to the otherwise flat diaphragm structure. This curvature modifies the mechanical properties of the peripheral region, enabling it to dampen resonances and control oscillation amplitudes, thereby reducing signal distortion without complicating the overall manufacturing process.
2Device complexity
If the movable diaphragm is made flat, then the device complexity is reduced, but oscillation amplitudes vary across frequencies causing signal distortion
Solution Approach 1:
The diaphragm structure implements local quality by having a flat central region for simplicity and a corrugated peripheral region for resonance control. This localized structural differentiation addresses signal distortion only where needed, maintaining overall device simplicity while improving high-frequency performance.
Solution Approach 2:
The movable diaphragm is segmented into two distinct functional regions: a flat central region and a corrugated peripheral region with multiple ridges and grooves. This segmentation allows each region to perform its specific function independently, with the peripheral region providing damping without requiring the entire diaphragm to be complex.
3Reliability
If a corrugated peripheral region is added to the movable diaphragm, then signal distortion is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The corrugated structure is applied only to the peripheral region of the diaphragm, not the entire structure. This localized application reduces the impact on manufacturing complexity while still achieving the desired signal distortion reduction, as only a portion of the diaphragm requires the more complex corrugated geometry.
Solution Approach 2:
The corrugated peripheral region uses standardized curved geometric features (ridges and grooves) that can be integrated into existing MEMS fabrication processes. The curvature is designed to provide effective resonance control while maintaining compatibility with standard manufacturing techniques, minimizing the increase in manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor device with a corrugated movable diaphragm significantly reduces signal distortion in the high frequency range, ensuring consistent sound output levels across frequencies.
Implementation Method 1
the movable diaphragm is corrugated in the peripheral region of the movable diaphragm. The corrugated portion of the movable diaphragm acts as a dampening element to reduce variations in oscillation amplitudes of the flat portion
Data Source
AI summary
Various embodiments of the present disclosure are directed towards a semiconductor device. The semiconductor device comprises a substrate. A cavity is disposed in the substrate. A microelectromechanical system (MEMS) layer is disposed over the substrate. The MEMS layer comprises a movable diaphragm disposed over the cavity. The movable diaphragm comprises a central region and a peripheral region. The movable diaphragm is flat in the central region of the movable diaphragm. The movable diaphragm is corrugated in the peripheral region of the movable diaphragm.