MEMS Diaphragm Packaging via Interposer Cavity Aperture
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Solution Overview
Problem
Conventional wafer-level packaging of MEMS components with diaphragm structures faces challenges in minimizing the area for connection contacts on the interposer, leading to a higher risk of contamination and damage during second-level assembly, as the passage aperture is typically large to accommodate sound introduction, limiting the available area for connections.
Innovation Solution
The passage aperture in the interposer is designed to be significantly smaller than the diaphragm structure, allowing for a larger area on the interposer for connections and reducing stress on the MEMS component, with a variable size, shape, and position, enabling larger-area connection contacts and minimizing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the passage aperture in the interposer is made large to accommodate sound introduction, then the sound introduction capability is improved, but the area available for connection contacts on the interposer is reduced
Solution Approach 1:
The invention introduces a cavity dimension between the diaphragm structure and the interposer, creating a three-dimensional acoustic chamber. This allows the passage aperture to remain small while still providing sufficient acoustic volume and sound introduction capability through the cavity space, thereby resolving the contradiction between aperture size and connection area.
Solution Approach 2:
The cavity is nested between the diaphragm structure and the interposer, creating a compact acoustic chamber within the existing package structure. This nested configuration maximizes the acoustic volume without increasing the overall package footprint, allowing small passage apertures to suffice for sound introduction while preserving interposer area for connections.
2Ease of operation
If the passage aperture area is increased, then the sound introduction is improved, but the risk of contamination and damage to the diaphragm structure increases
Solution Approach 1:
By transitioning from a two-dimensional aperture approach to a three-dimensional cavity structure, the invention achieves sufficient acoustic performance with smaller aperture openings. The cavity volume compensates for the reduced aperture area, maintaining sound introduction capability while minimizing the exposure area that could be contaminated or damaged during assembly.
Solution Approach 2:
The acoustic path is segmented into the passage aperture and the cavity volume, separating the function of sound introduction (aperture) from sound amplification (cavity). This segmentation allows the aperture to be minimized for protection purposes while the cavity provides the necessary acoustic function.
3Object-affected harmful factors
If the passage aperture is made small, then the contamination risk is reduced, but the area for second-level assembly connections is also reduced
Solution Approach 1:
The invention adds the vertical cavity dimension to compensate for the reduced horizontal aperture size. This dimensional transition allows small passage apertures to provide adequate acoustic function through the cavity volume, thereby preserving maximum interposer area for connection contacts without compromising sound introduction.
4Reliability
If conventional packages are used for MEMS components, then the mechanical protection is provided, but the manufacturing expenditure and component size are increased
Solution Approach 1:
The invention merges the package substrate and interposer into a single integrated wafer-level structure. This consolidation eliminates the need for separate conventional packages while providing equivalent mechanical protection, thereby reducing manufacturing complexity and cost without compromising protective functionality.
Solution Approach 2:
The invention transitions from conventional discrete packaging to wafer-level integrated packaging, changing the scale and integration parameters of the package structure. This parameter change enables mass production efficiency and cost reduction while maintaining protective functions through the integrated design.
Data Source
AI summary
A wafer-level-based packaging concept for MEMS components having at least one diaphragm structure formed in the component front side is described, according to which an interposer is connected to the front side of the MEMS component, which has at least one passage aperture as an access opening to the diaphragm structure of the MEMS component and which is provided with electrical through contacts so that the MEMS component is electrically contactable via the interposer. The cross-sectional area of the at least one passage aperture in the interposer is to be designed as significantly smaller than the lateral extension of the diaphragm structure of the MEMS component. The at least one passage aperture opens into a cavity between the diaphragm structure and the interposer.