MEMS Driver Anti-Shake Photosensitive Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional anti-shake motors in camera modules have poor correction effects, complex structures, high costs, low yields, high power consumption, and large sizes, failing to meet the stringent requirements of miniaturized and high-performance electronic devices.
Innovation Solution
The implementation of a micro-electro-mechanical system (MEMS) driver with a flat attachment surface, such as a steel or ceramic substrate, to move photosensitive elements and provide a stable attachment surface, reducing the overall height and improving yield and reliability of the anti-shake camera module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional anti-shake motor is used to correct offset and rotation, then the anti-shake function is achieved, but the structure becomes complicated and the size increases
Solution Approach 1:
The traditional anti-shake motor is segmented into separate functional components: a driver for generating driving forces and a photosensitive element for detection, mounted on independent attachment surfaces. This segmentation allows each component to be optimized separately and simplifies the overall structure by eliminating the need for a complex integrated motor mechanism.
Solution Approach 2:
The patent introduces an attachment substrate as an intermediary component between the driver/photosensitive element and the circuit board. This substrate provides a stable mounting platform with precise attachment surfaces, enabling the driver and photosensitive element to function independently without requiring a complex integrated motor structure.
2Reliability
If a traditional anti-shake motor is used, then the anti-shake function is achieved, but the cost increases and yield decreases
Solution Approach 1:
By segmenting the anti-shake system into independent components (driver, photosensitive element, attachment substrate), each component can be manufactured separately using standardized processes, improving production yield and reducing costs compared to manufacturing complex integrated anti-shake motors.
Solution Approach 2:
The patent changes the operational parameters from a mechanical motor system to a controlled driving force system applied to a photosensitive element. This parameter change enables the use of simpler, more cost-effective manufacturing processes with higher yields.
3Reliability
If a traditional anti-shake motor is used, then the anti-shake function is achieved, but the power consumption increases
Solution Approach 1:
The patent replaces the traditional mechanical anti-shake motor system with a system that applies controlled driving forces to a photosensitive element. This substitution eliminates the need for continuous mechanical operation, reducing power consumption while maintaining anti-shake functionality.
4Device complexity
If the driver is directly attached to the circuit board, then the assembly is simplified, but the flatness and accuracy requirements cannot be met
Solution Approach 1:
The attachment substrate serves as an intermediary between the driver/photosensitive element and the circuit board. It provides precisely machined attachment surfaces with controlled flatness and accuracy, eliminating the need for direct attachment while maintaining assembly simplicity.
Solution Approach 2:
The attachment substrate is pre-prepared with precise attachment surfaces before the driver and photosensitive element are mounted. This preliminary action ensures that the required flatness and accuracy are achieved without complicating the subsequent assembly process.
5Volume of moving object
If the module size is reduced for miniaturization, then the compactness is improved, but the anti-shake performance deteriorates
Solution Approach 1:
The compact design is achieved by segmenting the anti-shake system into small, independent components (driver, photosensitive element) that can be closely integrated on a compact attachment substrate, maintaining anti-shake performance while reducing overall module size.
Solution Approach 2:
The patent optimizes the spatial arrangement of components in three-dimensional space, utilizing vertical stacking and compact positioning on the attachment substrate to maintain anti-shake functionality while minimizing the horizontal footprint and overall module volume.
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
The invention discloses an anti-shake camera module, an anti-shake photosensitive assembly, and manufacturing method thereof and an electronic device. The anti-shake photosensitive assembly includes a circuit board assembly, at least one driver, and at least one photosensitive element. The circuit board assembly provides at least one attachment surface. Each driver is correspondingly attached to each attachment surface of the circuit board assembly. Each photosensitive element is correspondingly arranged on each driver, and the driver is located between the photosensitive element and an attachment surface of the circuit board assembly, so that the corresponding photosensitive element is moved by the driver, thereby achieving the anti-shake function for the anti-shake photosensitive assembly.