MEMS Electrode-Connecting Layer Thickness for Notch Isolation
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Solution Overview
Problem
The existing MEMS structures face electrical defects due to notch formation during the etching process, which leads to electrical disconnection issues, especially when the MEMS activated element is etched to expose the substrate surface, causing an enlarged notch area and potential electrical disconnection.
Innovation Solution
A MEMS structure with an electrode-connecting layer of specified thickness less than 5 μm is formed, which remains after etching the upper portion of the MEMS activated element, and a connecting line is deposited to connect the electrode pad and the electrode-connecting layer, preventing electrical defects by minimizing notch-induced disconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the MEMS activated element is etched completely to expose the substrate surface, then the etching depth is improved, but the notch area is enlarged causing electrical disconnection
Solution Approach 1:
The invention segments the side surface of the MEMS activated element into multiple regions: an upper etched portion and a lower unetched portion that remains as an electrode-connecting layer. This segmentation allows the upper part to be etched for proper device function while the lower part maintains electrical connection, preventing the electrical disconnection problem caused by complete etching.
Solution Approach 2:
The electrode-connecting layer is formed as a preliminary structural feature before the etching process. By pre-establishing this conductive bridge at the bottom of the MEMS activated element, the design ensures that even when the upper portions are etched away, the electrical connection path remains intact, preventing electrical disconnection.
2Reliability
If the thickness of the electrode-connecting layer is reduced, then the reliability of electrical connection is improved, but the manufacturing precision requirement increases
Solution Approach 1:
The invention optimizes the thickness parameter of the electrode-connecting layer to a specific range (0.1-5.0 μm, preferably 0.5-2.0 μm). This parameter optimization balances two competing requirements: thin enough to minimize notch area and maintain electrical connection reliability, but thick enough to provide sufficient mechanical strength and electrical conductivity. The specified range represents the optimal compromise point.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents electrical defects by ensuring a stable connection between the electrode pad and the MEMS activated element, even with notch formation, by maintaining a thin electrode-connecting layer thickness, thus enhancing the reliability of the MEMS structure.
Implementation Method 1
The connecting line may be formed by depositing a metal in a specified thickness
Data Source
AI summary
A MEMS structure includes an element substrate, an electrode pad formed on the element substrate, a MEMS activated element formed on the element substrate, and having an electrode-connecting layer, and a connecting line to electrically connect the electrode pad and the electrode-connecting layer.