MEMS Die Embedding in Packaging for Acoustic and EMI Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current packaging technologies for MEMS devices, such as sound transducers, face challenges in miniaturization, heterogeneous system integration, and cost-effectiveness, particularly in creating a compact form with necessary functionalities like mechanical protection, acoustical sound ports, and EMI shielding, while avoiding expensive etching processes.
Innovation Solution
A packaged MEMS device is developed with an embedding arrangement that includes a MEMS die embedded in an embedding material, a sound port for acoustic coupling, and a grille for protection and EMI shielding, using a wafer level packaging method that eliminates the need for deep reactive ion etching and integrates multiple dies in a single package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional chip packaging technologies are used for MEMS devices, then mechanical and electrical protection can be provided, but the device size becomes large and manufacturing cost increases
Solution Approach 1:
The patent merges the packaging structure with the MEMS device itself by embedding the MEMS die directly into the housing cavity. The housing serves dual purposes as both structural protection and acoustic enclosure, eliminating the need for separate packaging components. This integration reduces overall device volume while maintaining mechanical protection and electrical connectivity through the housing's built-in contact structures.
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: it provides mechanical protection for the MEMS die, creates the acoustic cavity, establishes electrical connections through integrated contacts, and defines the sound port geometry. This multi-functionality reduces the number of separate components needed, thereby reducing device size and manufacturing complexity while maintaining all necessary protective and functional characteristics.
2Device complexity
If conventional packaging methods with separate components are used, then protection is provided, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines multiple packaging functions into a single integrated housing structure that embeds the MEMS die directly. This eliminates the need for separate mounting brackets, individual protective covers, and external wiring harnesses, thereby reducing device complexity while maintaining comprehensive mechanical and environmental protection through the unified housing design.
Solution Approach 2:
The housing is pre-configured with integrated electrical contacts and acoustic cavity structures during the molding process, before the MEMS die is installed. This preliminary preparation of mounting features and protective structures within the housing reduces the number of subsequent assembly steps required and simplifies the overall packaging structure while ensuring proper protection and connectivity.
3Manufacturing precision
If expensive etching technologies are used for manufacturing, then precise acoustic ports can be created, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive mechanical etching processes with cost-effective injection molding techniques to create the acoustic cavity and sound port structures. The housing is molded with precise acoustic port geometries and cavity dimensions directly integrated into the tooling, achieving the required manufacturing precision through the mold design itself rather than through subsequent etching operations, thereby significantly reducing manufacturing cost.
Solution Approach 2:
The acoustic port structures and cavity geometries are pre-formed during the injection molding of the housing, before any MEMS die installation or additional processing. This preliminary creation of precise acoustic features through the molding process eliminates the need for costly post-processing etching steps while maintaining the required dimensional accuracy for acoustic performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a compact, cost-effective packaging solution with integrated mechanical and electrical protection, acoustical functionality, and EMI shielding, reducing fabrication costs and allowing for near-chip-scale integration of sound transducer components.
Implementation Method 1
a packaged MEMS device is provided that comprises an embedding arrangement, a MEMS device disposed in the embedding arrangement
Implementation Method 2
a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device
Implementation Method 3
a grille disposed in the sound port
Data Source
AI summary
A packaged MEMS device may include an embedding arrangement, a MEMS device disposed in the embedding arrangement, a sound port disposed in the embedding arrangement and acoustically coupled to the MEMS device, and a grille within the sound port. Some embodiments relate to a sound transducer component including an embedding material and a substrate-stripped MEMS die embedded into the embedding material. The MEMS die may include a diaphragm for sound transduction. The sound transducer component may further include a sound port within the embedding material in fluidic or acoustic contact with the diaphragm. Further embodiments relate to a method for packaging a MEMS device or to a method for manufacturing a sound transducer component.