MEMS Encapsulation via Carrier Segmentation and Half-Shell Protection
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Solution Overview
Problem
Mechanically sensitive MEMS components, such as those with filigree or movable structures, are prone to damage during the transfer molding process used for encapsulation, as existing methods do not provide adequate protection against mechanical stress.
Innovation Solution
A component design where a MEMS component is arranged below a half-shell on a carrier, creating a cavity that encases the MEMS component, allowing for reliable encapsulation without direct pressure on the sensitive parts, using a molding compound that covers the carrier and side surfaces while keeping external connections accessible.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transfer molding method is used to encapsulate MEMS components, then encapsulation efficiency and environmental protection are improved, but mechanical damage to MEMS components occurs due to high pressure
Solution Approach 1:
The carrier is divided into a first carrier portion and a second carrier portion that are separable. The MEMS component is mounted on the first carrier portion and can be removed after molding, allowing the molded product to be separated into different parts. This segmentation enables the MEMS component to be protected during molding while maintaining encapsulation effectiveness.
Solution Approach 2:
The first carrier portion acts as an intermediary protective structure during the transfer molding process. It supports the MEMS component and absorbs or distributes the molding pressure, preventing direct mechanical damage to the sensitive MEMS structures. The carrier serves as a mediator between the high-pressure molding process and the fragile MEMS component.
2Object-affected harmful factors
If MEMS component is protected before encapsulation, then mechanical damage is prevented, but production complexity increases
Solution Approach 1:
The protective function is merged with the carrier structure itself. The carrier is designed with a specific geometry (first and second carrier portions) that inherently provides protection during molding while serving its primary function of mounting and positioning the MEMS component. This eliminates the need for separate protective housings or additional protective structures.
Solution Approach 2:
The carrier serves multiple functions: it mounts the MEMS component, provides mechanical protection during molding, enables easy removal after encapsulation, and facilitates the separation of the molded product into different parts. This multi-functionality reduces the need for additional components and simplifies the overall production process.
3Object-affected harmful factors
If complete packaging of MEMS component is implemented, then environmental protection is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The MEMS component is pre-mounted on the first carrier portion before the transfer molding process. This preliminary mounting action positions the component correctly and provides immediate protection during subsequent molding operations, eliminating the need for complex post-molding assembly or additional protective measures.
Solution Approach 2:
The protective approach shifts from complete three-dimensional encapsulation to a partial protection strategy using the carrier structure. The first carrier portion provides protection in critical dimensions during molding, while the molded compound provides environmental protection from other directions, distributing the protection function across different dimensions and methods.
Data Source
AI summary
A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process.