MEMS Movable Part Fixing During Semiconductor Rewiring and Dicing
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Solution Overview
Problem
The manufacturing process of semiconductor integrated circuit devices with MEMS elements, such as air pressure sensors, is prone to damage during dicing and rewiring due to strong vibrations and exposure to chemicals, leading to increased costs and potential deterioration of MEMS element characteristics.
Innovation Solution
The method involves fixing the movable part of the MEMS element before forming a rewiring layer and dicing, and then releasing it through etching as a wafer process, which reduces damage during the rewiring and dicing processes by immobilizing the MEMS element before these steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the MEMS element is released before dicing and rewiring, then the MEMS element can function properly, but the strong vibration and chemical exposure during dicing and rewiring damage the MEMS element
Solution Approach 1:
The patent applies preliminary action by keeping the MEMS element in a fixed state before dicing and rewiring operations, then releasing it afterward. This prevents damage during the harmful processes while ensuring proper functionality afterward. The fixed state is maintained through structural design that constrains the MEMS element during manufacturing steps that would otherwise damage it.
2Object-affected harmful factors
If the MEMS element is kept fixed during dicing and rewiring, then damage is reduced, but the MEMS element cannot function until released
Solution Approach 1:
The patent uses preliminary action by establishing the fixed state before the harmful dicing and rewiring processes, then performing the release action afterward. This sequence ensures protection during manufacturing while restoring functionality in the final product.
Solution Approach 2:
The patent inverts the conventional sequence by keeping the MEMS element fixed during manufacturing (opposite of the usual released state), then releasing it afterward. This inversion protects the element during harmful processes while maintaining the ability to function in the final product.
3Productivity
If conventional manufacturing processes are used, then production is efficient, but the processing cost increases due to MEMS element damage
Solution Approach 1:
The patent applies preliminary action by preparing the MEMS element in a fixed state before dicing and rewiring, preventing damage and reducing waste. This maintains high production efficiency while reducing losses from damaged elements, thereby lowering overall manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes damage to the MEMS element during the manufacturing process, enhancing the reliability and reducing costs associated with MEMS element integration in semiconductor integrated circuit devices.
Implementation Method 1
releasing the movable part by etching as a wafer process after dicing
Data Source
AI summary
In a method of manufacturing a semiconductor integrated circuit device having an MEMS element over a single semiconductor chip, the movable part of the MEMS element is fixed before the formation of a rewiring. After formation of the rewiring, the wafer is diced. Then, the movable part of the MEMS element is released by etching the wafer.