MEMS Housing with Getter-Managed Multi-Cavity Pressures
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Solution Overview
Problem
Current wafer-level packaging technologies for micromechanical systems (MEMS) cannot independently set and maintain different gas pressures and compositions in multiple cavities, limiting the integration and functionality of complex microsystem components, particularly in applications requiring specific ambient pressures for resonant sensors and other microsensors.
Innovation Solution
A method involving the use of getter materials in specific cavities to selectively absorb gases, allowing for independent control of internal pressures and gas compositions in multiple cavities within MEMS components during the bonding process, enabling the creation of MEMS with cavities having different pressures and gas mixtures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer-level packaging is used to encapsulate multiple micromechanical systems, then productivity and cost-effectiveness are improved, but the ability to maintain different gas pressures in different cavities deteriorates
Solution Approach 1:
The patent divides the packaging structure into multiple independent cavities (first cavity and second cavity), each capable of maintaining different gas pressures. The cap wafer is segmented with through-opening structures that allow selective access to specific cavities during the packaging process, enabling independent pressure control while maintaining overall wafer-level packaging efficiency
Solution Approach 2:
The invention applies different gas pressures to different local regions (cavities) of the packaged wafer. Through-opening structures in the cap wafer enable selective filling of specific cavities with gases at different pressures, allowing each cavity to have the optimal gas pressure for its specific micromechanical system while maintaining high productivity through parallel processing
2Adaptability or versatility
If multiple micromechanical systems with different pressure requirements are integrated into a single component, then device functionality is improved, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary actions by pre-defining cavity regions in the substrate wafer and corresponding through-opening structures in the cap wafer before the packaging process. Getter materials are pre-applied to specific cavity regions, and the through-opening patterns are pre-established to guide selective gas filling, thereby simplifying the overall manufacturing process despite the complexity of producing multi-pressure devices
Solution Approach 2:
The invention uses through-opening structures in the cap wafer as intermediary elements that enable selective access to different cavities during gas filling. These intermediary structures allow the packaging process to maintain simplicity while achieving complex multi-pressure functionality, as they provide a straightforward mechanism for controlling which cavities are filled with which gases at what pressures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise setting of operating pressures and gas compositions in MEMS components, enhancing integration density and functionality by enabling the co-packaging of diverse sensor systems with different pressure requirements on a single component, thereby improving the reliability and performance of microsystem technologies.
Implementation Method 1
A first of the at least two cavities is provided with a getter material, and the bonding of the substrate and cap is carried out in an atmosphere containing at least one type of gas particles which can be absorbed by the first getter material, whereby, due to the absorption properties of the first getter material towards this type of gas particles, after activation of the first getter material, the first of the two cavities has a different internal pressure and/or a different gas composition than a second cavity
Data Source
Figure 1~3
Figure 2
Figure 4A~4C
AI summary
The invention relates to a multiple component which is to be subsequently individualised by forming components containing active structures, in addition to a corresponding component which can be used in microsystem technology systems. Said multiple component and/or component comprises a flat substrate and also a flat cap structure which are bound to each other such that they surround at least one first and one second cavity per component, which are sealed against each other and towards the outside. Said component is characterised in that the first of the two cavities is provided with getter material and due to said getter material has a different internal pressure and/or a different gas composition than the second cavity. The invention also relates to a method for producing said type of component and/or components for which gas mixtures of various types of gas have a different absorption ratio in relation to the getter material.