MEMS Package Glue Bleed Stopper and Universal Lead Frame
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Solution Overview
Problem
Existing semiconductor packaging methods for MEMS devices face challenges in achieving high acoustic performance and compatibility with various circuit board orientations, often resulting in increased manufacturing costs and decreased performance due to the use of multiple PCB layers or reduced compatibility.
Innovation Solution
A semiconductor package design featuring an electrically conductive lead-frame with a die paddle and conductive leads, surrounded by an insulating molding compound with a ridge and interior sidewall forming a dam to contain liquefied sealant, allowing for a universally compatible 'port facing up' or 'port facing down' configuration without the need for multiple PCB layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple PCB layers are used to achieve different mounting configurations, then compatibility with various circuit board orientations is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The lead-frame is designed with a universal structure that can accommodate both 'port facing up' and 'port facing down' configurations through simple lead bending, eliminating the need for multiple specialized PCB layers. The single lead-frame structure performs multiple functions by adapting to different mounting orientations.
Solution Approach 2:
Instead of creating different PCB layer configurations for different orientations, the invention inverts the approach by using a single lead-frame that can be bent into different configurations. The lead-frame structure is made adaptable through physical deformation rather than through multiple rigid layers.
2Reliability
If a ridge is added to the die paddle to form a glue bleed stopper, then sealant containment and acoustic sealing are improved, but manufacturing complexity increases
Solution Approach 1:
The ridge is pre-formed on the die paddle before the sealant application process. This preliminary structural feature ensures that when liquid sealant is applied, it is automatically contained and guided to the correct location, preventing bleed-through and ensuring proper acoustic sealing without requiring complex real-time control mechanisms.
Solution Approach 2:
The ridge acts as an intermediary structural element between the sealant application process and the final acoustic seal. It mediates the flow of liquid sealant, directing it to form the desired acoustic barrier while preventing excessive spread, thus simplifying the overall sealing process.
Data Source
AI summary
A semiconductor package includes an electrically conductive lead-frame, including a first die paddle having a first opening, and a plurality of electrically conductive leads, a ridge formed around a perimeter of the first opening, and an electrically insulating molding compound. The electrically insulating molding compound includes an interior cavity being defined by a planar base surface and outer sidewalls, a second opening formed in the base surface, and an interior sidewall within the interior cavity. The molding compound is formed around the lead-frame with the first die paddle in the interior cavity. The first and second openings are aligned with one another so as to form a port that provides access to the interior cavity. The ridge and the interior sidewall form a dam that is configured to collect liquefied sealant and prevent the liquefied sealant from overflowing into the port or into adjacent regions of the interior cavity.