MEMS Gyro Sensor Package Size Reduction via Flexible Substrate
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Solution Overview
Problem
The size and weight of traditional MEMS gyroscope packages limit their application in small portable devices, as they occupy significant space on circuit boards and hinder the integration of multiple sensors for multi-axis movement sensing.
Innovation Solution
A MEMS die is directly mounted on a multi-layer flexible substrate with metal layers, eliminating the need for a ceramic enclosure and using wire bonding and a protective lid or die coating for electrical connections, allowing for a smaller, lighter package design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional ceramic enclosure with lid is used to protect the MEMS die, then the structural integrity and protection of the die is improved, but the package size and weight increase significantly
Solution Approach 1:
The patent removes the traditional ceramic enclosure and lid structure, extracting only the essential protective function. The MEMS die is mounted directly on the flexible substrate without the bulky ceramic housing, achieving volume reduction while maintaining die protection through alternative means (substrate integration and selective coating).
Solution Approach 2:
The patent employs a multi-layer flexible substrate as the protective structure instead of rigid ceramic. The substrate includes protective layers and coating structures that provide necessary protection while being thin and flexible, enabling significant size reduction compared to traditional ceramic enclosures.
2Ease of manufacture
If a traditional rigid package structure is used, then the handling and manufacturing process is simplified, but the device weight and spatial requirement increase
Solution Approach 1:
The rigid ceramic package is replaced with a flexible multi-layer substrate structure. This flexible substrate maintains ease of manufacturing through standard flexible PCB processes while dramatically reducing weight compared to ceramic materials, enabling portable applications.
Solution Approach 2:
The patent transitions from a three-dimensional rigid ceramic enclosure to a planar flexible substrate structure. This dimensional change allows the package to be flattened and integrated into thin portable devices while maintaining structural integrity and ease of assembly.
3Adaptability or versatility
If multiple MEMS gyroscopes are integrated for multi-axis sensing, then the sensing capability is improved, but the footprint on the circuit board increases
Solution Approach 1:
The patent combines multiple MEMS gyro die onto a single flexible substrate, merging what would traditionally require separate packages into one integrated unit. This consolidation reduces the total footprint on the circuit board while maintaining full multi-axis sensing capability through the stacked or adjacent arrangement of die.
Solution Approach 2:
The patent utilizes the vertical dimension by stacking or closely arranging multiple MEMS die on the flexible substrate in a compact configuration. This three-dimensional integration approach reduces the two-dimensional footprint on the circuit board while accommodating multiple sensors for comprehensive multi-axis detection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a 55% to 80% reduction in package size and weight, enabling more compact and versatile integration of gyro sensors in portable devices with reduced manufacturing complexity.
Implementation Method 1
The MEMS die and electrical connections are protected with a lid or die coating
Data Source
AI summary
An integrated circuit packaging structure comprises at least one Micro Electrical Mechanical Systems (MEMS) gyroscope die mounted directly on a multi-layer flexible substrate having at least one metal layer and wire-bonded to the flexible substrate and a lid or die coating protecting the MEMS die and wire bonds.