MEMS Heater Structural Design for Thermal Warpage Control
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Solution Overview
Problem
MEMS sensors are prone to deformation and reduced accuracy due to thermal stress during heating, which affects their reliability and measurement accuracy.
Innovation Solution
The design incorporates a central part with a heater and connecting parts that have non-parallel reference lines, allowing for easier bending and reduced effective bending stiffness, thereby minimizing warpage and thermal stress deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the MEMS sensor is heated by a heating device to improve measurement accuracy, then the measurement accuracy is improved, but thermal stress causes deformation and reduces reliability
Solution Approach 1:
The central part is divided into multiple segments (first central part, second central part, third central part) connected by joints, allowing each segment to move independently under thermal stress, thereby reducing overall deformation while maintaining heating functionality
Solution Approach 2:
The connecting parts are designed with non-parallel reference lines and specific geometric configurations that change their mechanical properties under thermal conditions, allowing them to accommodate thermal expansion and contraction while minimizing warpage
2Measurement precision
If the MEMS sensor is heated by a heating device to improve measurement accuracy, then the measurement accuracy is improved, but thermal stress causes warpage and reduces accuracy
Solution Approach 1:
The structure is segmented into multiple parts that can move relative to each other, preventing uniform warpage across the entire sensor while maintaining the heated temperature required for accurate measurement
Solution Approach 2:
The connecting parts use non-parallel reference lines and asymmetric geometric configurations that are specifically designed to counteract thermal warpage, allowing the structure to maintain flatness under thermal stress
3Stability of the object's composition
If the central part is connected rigidly to the periphery part to maintain structural stability, then structural stability is improved, but thermal stress causes deformation
Solution Approach 1:
The connecting parts are designed as dynamic structures with degrees of freedom that allow them to adapt their configuration under thermal stress, maintaining structural integrity while accommodating shape changes through controlled movement at the joints
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and accuracy of MEMS sensors by reducing deformation and warpage caused by thermal stress, improving their operational performance.
Implementation Method 1
The heater is disposed in the central part. A displacement of the first joint is produced when the central part is heated by the heater.
Implementation Method 2
A displacement of the first joint is produced when the central part is heated by the heater
Data Source
AI summary
A MEMS apparatus with heater includes central part, periphery part, gap and first connecting part. Central part includes center of mass, heater and first joint. Heater is disposed inside central part. First joint is located on boundary of central part. Displacement of first joint is produced when central part is heated by heater. Periphery part surrounds central part. Gap surrounds central part, and is located between central part and periphery part. First connecting part connects central part and periphery part along first reference line and includes first inner connecting portion and first outer connecting portion. First inner connecting portion is connected to first joint. First outer connecting portion is connected to periphery part. First reference line passes through first joint, and first reference line is not parallel to line connecting center of mass and first joint.