MEMS Hinge Layer Spring Mechanism for Sticking Prevention
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Solution Overview
Problem
Existing MEMS devices, such as digital micro-mirror devices, face challenges in achieving a wide operation window, high reliability, and long lifetime due to limitations in effectively utilizing electrostatic force to switch micro-mirror states and maintaining hinge layer functionality.
Innovation Solution
The MEMS device incorporates a hinge layer with a cantilever portion and spring mechanism, where the spring touches the landing element after the hinge portion is distorted, allowing for easier release and reducing the risk of sticking, thereby widening the operation window and reducing the required electrostatic force for state switching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrostatic force is increased to ensure the hinge layer switches state reliably, then the switching reliability is improved, but the force of the cantilever portion striking the landing element increases, reducing the device lifetime
Solution Approach 1:
The patent introduces a spring mechanism that acts as a cushioning element between the cantilever portion and the landing element. When the hinge layer switches state, the spring absorbs the impact energy and prevents direct striking of the landing element, thereby protecting the device structure and extending lifetime while maintaining reliable switching
2Duration of action of moving object
If the electrostatic force is reduced to decrease the striking force, then the device lifetime is improved, but the hinge layer may not switch state reliably, reducing operation reliability
Solution Approach 1:
The spring mechanism serves as an intermediary element that mediates between the cantilever portion and the landing element. It allows the hinge layer to switch state with reduced electrostatic force while still achieving reliable contact, as the spring provides the necessary mechanical leverage and cushioning to ensure proper engagement without requiring high impacting forces
3Ease of manufacture
If the hinge layer structure is simplified to reduce manufacturing complexity, then the ease of manufacture is improved, but the response to voltage difference may be insufficient, reducing operation window
Solution Approach 1:
The patent merges the spring mechanism with the hinge layer structure, integrating multiple functions into a unified component. The spring is formed as part of the hinge layer assembly, combining the hinge function with the spring function in a single integrated structure, which simplifies manufacturing while maintaining effective voltage response and widening the operation window
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the response to voltage differences, increases the reliability of the MEMS device by preventing sticking and reducing the electrostatic force needed, leading to a longer device lifetime.
Implementation Method 1
the elastic force makes the cantilever portion leave the landing element more easily
Implementation Method 2
the swing of the micro-mirrors is driven by electrostatic force
Data Source
AI summary
A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.