MEMS Cooling Hood Layout for Backflow-Limited Processor Heat Removal
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Solution Overview
Problem
Current cooling solutions for computing devices, such as fans and passive heat spreaders, are inadequate for effectively managing heat in both mobile and larger devices, leading to performance throttling due to excessive heat generation, and are limited by size and configuration constraints.
Innovation Solution
A micro-electro-mechanical systems (MEMS) active cooling system comprising a tile with cooling cells and a hood that directs fluid flow, where the cooling cells undergo vibrational motion to drive air towards a heat-generating structure, enhancing heat transfer efficiency and reducing backflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If active cooling devices such as fans are used, then heat dissipation capability is improved, but device size and complexity increase
Solution Approach 1:
The patent employs a MEMS vibrational cooling device that uses ultrasonic vibrations to generate acoustic streaming, which drives fluid flow across the heat-generating surface. This mechanical vibration approach replaces traditional rotating fans, achieving effective heat dissipation in a compact, stationary configuration without moving parts, thereby resolving the contradiction between heat dissipation capability and device size/complexity
Solution Approach 2:
The invention substitutes the mechanical rotating fan system with a MEMS-based ultrasonic vibration system. The ultrasonic transducer converts electrical energy to mechanical vibrations at ultrasonic frequencies, creating acoustic radiation pressure that drives fluid flow. This substitution eliminates the need for large mechanical components while maintaining effective cooling, thus resolving the size and complexity issue
2Device complexity
If passive cooling devices such as heat spreaders are used, then device simplicity is maintained, but heat dissipation capability is insufficient for high-performance devices
Solution Approach 1:
The patent introduces ultrasonic mechanical vibrations to the passive heat spreader system, transforming it into an active cooling device. The vibrations generate acoustic streaming that enhances fluid flow and heat transfer coefficients, significantly improving heat dissipation capability while maintaining relative simplicity of the overall device structure
Solution Approach 2:
The invention changes the physical state and behavior of the cooling fluid by introducing ultrasonic vibrations. This creates acoustic radiation pressure and acoustic streaming effects that dramatically enhance fluid flow velocity and heat transfer efficiency, transforming the heat spreader from a passive to an active cooling system and resolving the heat dissipation insufficiency
3Volume of moving object
If cooling device size is reduced for mobile devices, then portability is improved, but cooling effectiveness decreases
Solution Approach 1:
The patent uses ultrasonic vibrations to generate intense acoustic streaming in a compact volume. The high-frequency vibrations create micro-scale fluid circulation patterns that are highly efficient at heat transfer, enabling effective cooling in a small footprint suitable for mobile devices without sacrificing cooling performance
Solution Approach 2:
The invention changes the fluid flow parameters through ultrasonic excitation, creating acoustic radiation pressure and enhanced convection currents. These parameter changes dramatically increase heat transfer coefficients within the compact device volume, resolving the contradiction between small size and effective cooling performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MEMS active cooling system efficiently dissipates heat from computing devices, allowing processors to operate at higher speeds for longer periods without throttling, while being compact enough for use in mobile devices and adaptable to various device configurations.
Implementation Method 1
The cooling element is supported by the support structure and is configured to undergo vibrational motion when actuated to drive air toward a heat-generating structure
Implementation Method 2
The MEMS active cooling system efficiently dissipates heat from computing devices
Data Source
AI summary
A system including a tile and a hood is described. The tile includes a plurality of cooling cells. Each of the cooling cells includes a support structure and a cooling element. The cooling element is supported by the support structure and is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The hood is coupled to the tile and directs the fluid around the plurality of cooling cells.