MEMS Unit Infrared Protection Layer
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Solution Overview
Problem
MEMS sensors are vulnerable to non-invasive infrared investigations, which compromise the security of hardware-based keys by allowing partial reading or copying through infrared spectroscopic methods, reducing their security.
Innovation Solution
Incorporating or applying a layer with specific optical properties, such as metallic layers, within or on the MEMS unit that absorbs, reflects, or diffusely scatters at least 50% of incident infrared light, making the system non-transparent and difficult to investigate using infrared methods, and ensuring the layer's structural properties prevent easy removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the MEMS unit structure is made transparent to infrared light for measurement purposes, then infrared investigations can be performed, but security of hardware-based keys is compromised
Solution Approach 1:
An infrared-absorbing layer is introduced as an intermediary between the infrared light source and the MEMS sensor structure. This layer selectively absorbs infrared radiation, preventing it from penetrating into the sensor and exposing internal physical properties, thereby protecting the security of hardware-based keys while allowing the sensor to function normally
Solution Approach 2:
The harmful transparency property is extracted and removed from the MEMS unit structure by adding a dedicated infrared-absorbing layer. This layer takes out the vulnerability to infrared investigations by absorbing the infrared light before it can reveal internal sensor properties, effectively separating the measurement capability from the security vulnerability
2Reliability
If an infrared-absorbing layer is added to protect against infrared investigations, then security is improved, but device complexity increases
Solution Approach 1:
The infrared-absorbing layer serves multiple functions simultaneously: it absorbs infrared radiation to prevent security compromises, maintains mechanical integrity of the sensor structure, and can be integrated into existing MEMS manufacturing processes. This multi-functionality minimizes the increase in device complexity while achieving security protection
Solution Approach 2:
The solution uses composite material structures combining the infrared-absorbing layer with the existing MEMS sensor materials. By selecting materials with appropriate infrared absorption properties that are compatible with standard MEMS fabrication, the structural complexity is minimized while achieving the desired security protection
3Reliability
If a thick infrared-absorbing layer is used to block infrared light, then security is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
Instead of relying on thick layers that would require tight thickness control, the solution changes the material parameter by selecting substances with high infrared absorption coefficients. This allows achieving effective infrared blocking with thin layers, thereby reducing manufacturing precision requirements while maintaining security enhancement
Solution Approach 2:
The infrared-absorbing layer is applied selectively in specific regions where infrared absorption is needed, rather than uniformly throughout the entire structure. This localized application reduces the overall material usage and simplifies manufacturing precision requirements by focusing the absorption function only where necessary for security protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly enhances the security of MEMS sensors by preventing or rendering difficult non-invasive infrared investigations, maintaining the integrity of the physical properties used for key generation and ensuring the security of secrets, while making invasive attempts laborious and potentially damaging.
Implementation Method 1
at least one layer is incorporated into the structure of the MEMS unit or at least one layer is applied on a surface of the MEMS unit, which, on account of its optical properties, absorbs, reflects or diffusely scatters at least 50%, in particular at least 90% of an infrared light incident or irradiated upon it
Implementation Method 2
at least one layer is incorporated into the structure of the MEMS unit or at least one layer is applied on a surface of the MEMS unit, which, on account of its optical properties, absorbs, reflects or diffusely scatters at least 50%, in particular at least 90% of an infrared light incident or irradiated upon it
Implementation Method 3
at least one layer is incorporated into the structure of the MEMS unit or at least one layer is applied on a surface of the MEMS unit, which, on account of its optical properties, absorbs, reflects or diffusely scatters at least 50%, in particular at least 90% of an infrared light incident or irradiated upon it
Data Source
AI summary
A method is provided for protecting a MEMS unit against infrared investigations, at least one layer being built into the structure of the MEMS unit or at least one layer being applied on a surface of the MEMS unit. The at least one layer absorbs, reflects or diffusely scatters more than 50%, in particular more than 90% of an infrared light incident upon it.