MEMS Infrared Sensor with Movable Reflecting Plate

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Solution Overview

Problem

Current microelectromechanical infrared sensing devices face challenges in maintaining performance across varying temperatures due to ineffective thermal insulation, leading to heat loss and reduced sensing accuracy, and are limited by a fixed distance between infrared layers causing saturation in high-resolution readout circuits.

Innovation Solution

A microelectromechanical infrared sensing device with a dual-layer structure featuring a suspended reflecting plate and sensing plate, with adjustable distance via stoppers and a voltage-controlled mechanism, forming thermal insulation chambers to enhance thermal insulation and prevent saturation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a fixed distance structure is used between infrared layers, then manufacturing is simple, but the readout circuit saturates easily and sensing range is limited

Engineering Contradiction:
Improvesensing rangeVSAvoidstructure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a movable reflecting plate that can adjust its position relative to the sensing plate, transforming the fixed distance structure into a dynamic one. This allows the distance between the infrared absorbing layer and reflecting layer to be adjusted, enabling the readout circuit to operate within its dynamic range and preventing saturation while expanding the sensing range.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the physical parameter of distance between infrared layers by introducing a movable reflecting plate. This parameter adjustment allows optimization of the optical path and thermal insulation characteristics, resolving the contradiction between simple structure and adaptability.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If thermal insulation structure is simplified, then device complexity is reduced, but heat loss increases and sensing accuracy decreases

Engineering Contradiction:
Improvesensing accuracyVSAvoidthermal insulation structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the thermal insulation function into multiple components: the suspended sensing plate structure, the movable reflecting plate, and the enclosed spaces between them. This segmentation creates effective thermal insulation chambers that reduce heat loss and improve sensing accuracy without requiring a complex dedicated insulation structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The suspended sensing plate and reflecting plate act as thermal insulation intermediaries, creating air gaps and enclosed spaces that naturally reduce heat transfer. This approach improves thermal insulation performance through structural design rather than adding specialized insulation materials.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If infrared absorbing layer is made sensitive to temperature, then sensing capability is improved, but thermal stress causes bending and distance inconsistency

Engineering Contradiction:
Improvesensing capabilityVSAvoiddistance consistency
Core Design Contradiction:
Measurement precisionVSStability of the object's composition

Solution Approach 1:

The patent compensates for thermal expansion effects by making the reflecting plate movable rather than fixed. The dynamic adjustment capability allows the system to maintain optimal distance relationships between components despite thermal stress-induced bending of the sensing plate, preserving both sensing capability and distance consistency.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces heat loss, enhances sensing accuracy, and expands the sensing range by allowing adjustable absorbing rates, preventing readout circuit saturation across different temperatures.

Implementation Method 1

a sensing plate (12) disposed above the reflecting plate (11)... an infrared absorbing layer (121, 122)

Methodology Applied
Scientific EffectInfrared absorption: Absorption (EM radiation)

Implementation Method 2

a reflecting plate (11)... an infrared reflecting layer (111)... configured to reflect the infrared light

Methodology Applied
Scientific EffectInfrared reflection: Reflection

Implementation Method 3

the sensing plate (12) is suspended above the substrate... effectively reduce the heat loss

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20220196479A1Microelectromechanical infrared sensing device
Publication Date: 2022.06.23 IND TECH RES INST
  • US20220196479A1 patent drawing
  • US20220196479A1 patent drawing
  • US20220196479A1 patent drawing

AI summary

A microelectromechanical infrared sensing device is provided, which includes a substrate, a sensing plate, a reflecting plate, a plurality of first supporting elements, a plurality of second supporting elements and a plurality of stoppers. The second supporting elements are connected to the sensing plate, such that the sensing plate is suspended above the substrate. The reflecting plate is disposed between the substrate and the sensing plate. The first supporting elements are connected to the reflecting plate, such that the reflecting plate is suspended between the substrate and the reflecting plate. When the reflecting plate moves toward the substrate and at least one of the stoppers contacts the substrate or the reflecting plate, the distance between the reflecting plate and the sensing plate increases.