MEMS Jet Microchannel Cooling for Low Pressure Drop

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Solution Overview

Problem

Conventional liquid cooling systems for high-power computing devices suffer from inefficiencies such as large pressure drops and inadequate cooling capabilities, particularly for future devices with increased heat generation.

Innovation Solution

A liquid cooling system with jet channels proximate to heat-generating structures, configured to minimize boundary layer development and compensate for heating, using materials and geometries that enhance heat transfer and mitigate hot spots.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional liquid cooling systems use long microchannels to cool high-power devices, then cooling coverage is improved, but pressure drops increase and cooling efficiency decreases

Engineering Contradiction:
Improvecooling capabilityVSAvoidpressure drop
Core Design Contradiction:
TemperatureVSStress or pressure

Solution Approach 1:

The cooling plate is divided into multiple segments with individual microchannels for each segment. This segmentation allows independent flow control and reduces the overall pressure drop by distributing the flow through multiple parallel paths rather than requiring liquid to traverse long single channels across the entire cooling plate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a vertical dimension by forming microchannels that extend through the thickness of the cooling plate segments rather than only across the surface. This three-dimensional channel configuration reduces the effective flow path length and pressure drop while maintaining comprehensive cooling coverage.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If conventional liquid cooling systems use single long microchannels, then manufacturing is simpler, but cooling performance for future high-power devices becomes inadequate

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidcooling performance
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The cooling plate is segmented into multiple independent sections, each with its own microchannel. This segmentation enables better thermal management for future high-power devices by allowing localized cooling optimization while maintaining manufacturing feasibility through modular construction and independent channel formation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements dynamic flow control capabilities by providing independent flow control mechanisms for each microchannel segment. This allows the system to adapt flow rates dynamically based on local heat generation patterns, optimizing cooling performance for evolving high-power device requirements.

Inventive Principle:
Principle #15Dynamics

3Loss of energy

If liquid flows through long microchannels, then heat is carried away effectively, but boundary layer development reduces heat transfer efficiency

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidthermal management
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

By segmenting the cooling plate into multiple sections with independent microchannels, the patent prevents extensive boundary layer development along single long channels. Each segment's shorter channel length maintains more effective heat transfer by limiting the distance over which the boundary layer can develop and reduce thermal resistance.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system provides superior cooling performance at lower flow rates with improved thermal management and reduced hot spots, enhancing the performance of heat-generating devices.

Implementation Method 1

The liquid undergoes laminar flow through the microchannels and carries heat away with it

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

a pump to drive liquid (e.g., water) some distance to a cooling plate thermally coupled to the computing device and through the long microchannels of the cooling plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260011623A1Liquid MEMS cooling system
Publication Date: 2026.01.08 FRORE SYSTEMS INC
  • US20260011623A1 patent drawing
  • US20260011623A1 patent drawing
  • US20260011623A1 patent drawing

AI summary

A liquid cooling system is described. The liquid cooling system includes inlet(s), outlet(s), a manifold, and jet channels. The manifold is coupled to the inlet(s) and outlet(s). The jet channels are coupled to the manifold. The jet channels are microchannels. A portion of each of the jet channels is proximate to a heat-generating structure. The jet channels are configured such that a boundary layer in a liquid at a surface of a jet channel is not substantially developed within at least the portion of the jet channel proximate to the heat-generating structure. The jet channels are configured to receive fluid from the inlet(s) through the manifold and to provide the fluid through the manifold to the outlet(s). The jet channels and/or the manifold are configured to compensate for heating of the liquid in the cooling system.