MEMS Sensor Lid Substrate Hall Effect Integration

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Solution Overview

Problem

Existing MEMS sensors do not have integrated magnetic sensing capabilities, limiting their functionality when used in combination with magnetic sensors.

Innovation Solution

A MEMS sensor is developed that incorporates a base substrate with a displaceably supported movable portion and a lid substrate capable of functioning as a magnetic sensor using the Hall effect, allowing for the detection of inclination and azimuth, with the lid substrate acting as the magnetic sensor and the base substrate having specific contact and external pads for electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a MEMS sensor is used alone without magnetic sensing capabilities, then the device structure remains simple and manufacturing is easier, but the functionality is limited and cannot detect magnetic field variations

Engineering Contradiction:
Improvemagnetic sensing capabilityVSAvoidsensor structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The lid substrate is designed to serve dual functions: as a structural component covering the MEMS sensor and as a magnetic sensor itself. By forming a conductive film on the lid substrate that functions as a Hall element, the same component performs both protective/structural roles and magnetic detection roles, eliminating the need for a separate magnetic sensor chip.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the MEMS sensor and magnetic sensor into a single integrated device. The lid substrate of the MEMS package is merged with Hall element functionality through the conductive film, creating a unified sensor system that detects both mechanical acceleration and magnetic field variations simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

2Volume of stationary object

If separate MEMS sensor and magnetic sensor chips are used, then each sensor can be optimized independently, but the package size increases and integration is complex

Engineering Contradiction:
Improvepackage sizeVSAvoidmanufacturing process
Core Design Contradiction:
Volume of stationary objectVSEase of manufacture

Solution Approach 1:

The lid substrate serves multiple purposes: it covers the MEMS sensor cavity, provides structural support, and acts as the active magnetic sensing element through the conductive film. This multi-functionality eliminates the need for separate magnetic sensor packaging, reducing overall package size while maintaining manufacturing simplicity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The magnetic sensing functionality is nested within the existing MEMS sensor package structure. The conductive film forming the Hall element is integrated into the lid substrate, which is already part of the MEMS package assembly, allowing the magnetic sensor to be embedded without adding external components or increasing package dimensions.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Adaptability or versatility

If a conventional lid substrate is used without conductive film, then manufacturing is simpler and material costs are lower, but magnetic detection capability cannot be achieved

Engineering Contradiction:
Improvemagnetic detection functionVSAvoidmanufacturing process
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The lid substrate's electrical properties are changed by adding a conductive film, transforming it from an electrically insulating or non-conductive component into an active magnetic sensing element. This parameter change enables Hall effect-based magnetic detection while using standard semiconductor manufacturing processes that deposit conductive layers, maintaining ease of manufacture.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The lid substrate becomes a composite structure combining the substrate material (providing mechanical strength and structural function) with a conductive film layer (providing magnetic sensing capability). This composite approach allows each material to contribute its optimal properties while maintaining compatibility with existing manufacturing processes.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the realization of a single-chip device that can detect both acceleration and magnetic variations, reducing package size and maintaining existing manufacturing processes, while improving magnetic sensor performance by using a low-resistance semiconductor substrate and conductive films with lower bandgaps.

Implementation Method 1

a lid substrate covering the movable portion and capable of functioning as a magnetic sensor that detects magnetism by making use of the Hall effect

Methodology Applied
Scientific EffectHall effect: Hall Effect

Data Source

PatentUS10139456B2MEMS sensor, method for manufacturing the same, and MEMS package including the same
Publication Date: 2018.11.27 ROHM CO LTD
  • US10139456B2 patent drawing
  • US10139456B2 patent drawing
  • US10139456B2 patent drawing

AI summary

A MEMS sensor according to the present invention includes a base substrate including a displaceably supported movable portion and a lid substrate covering the movable portion and functioning as a magnetic sensor that detects magnetism by making use of the Hall effect.