MEMS Light Deflector Structure for High-Frequency Large-Mirror Scanning
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Solution Overview
Problem
Existing MEMS devices face a decrease in resonance frequency due to upsizing of the movable portion, which affects the performance of horizontal scanning and raster scanning.
Innovation Solution
The introduction of a support thick portion and a connecting thick portion connected to a drive beam, which increases the torsional stiffness of the torsion bars, allowing for higher resonance frequencies and maintaining drive sensitivity even with larger mirrors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the movable portion (mirror) is upsized to improve scanning coverage and image quality, then the scanning area and resolution are improved, but the resonance frequency decreases affecting scanning performance
Solution Approach 1:
The patent applies local quality by creating thick portions at specific locations of the support and connecting portion. These localized thickened areas increase torsional stiffness where needed most (at the support root and connecting portion) without increasing the overall mirror size, thereby maintaining high resonance frequency while achieving large scanning area through the larger mirror surface.
2Ease of operation
If the mirror size is increased to improve drive sensitivity, then the light deflection capability is improved, but the resonance frequency decreases reducing scanning speed
Solution Approach 1:
The patent changes the structural parameters of the support and connecting portion by introducing thick portions with increased thickness. This parameter change increases the torsional stiffness (k) of the suspension system, which directly affects the resonance frequency (f = 1/(2π) * √(k/m)). By increasing k through the thick portions while maintaining the same mirror mass m, the resonance frequency increases, enabling faster scanning speeds while preserving drive sensitivity through the larger mirror area.
3Device complexity
If the support structure is made thinner to reduce weight, then the device complexity is reduced, but the torsional stiffness decreases lowering resonance frequency
Solution Approach 1:
The patent applies segmentation by dividing the support structure into distinct regions: thin portions for most of the support length (reducing weight and maintaining simplicity) and localized thick portions at critical locations (increasing torsional stiffness where needed). This segmented approach allows the structure to be simple and lightweight overall while having strategically reinforced areas that provide the necessary structural rigidity for high resonance frequency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains or increases the resonance frequency and drive sensitivity of larger mirrors, preventing stress concentration and abrupt changes in shape, thereby enhancing the performance of horizontal and raster scanning.
Implementation Method 1
a drive beam connected to the other end of the support to deform the support to cause the movable portion to oscillate about an oscillation axis
Implementation Method 2
The support thick portion and the connecting thick portion are connected to each other... increases the torsional stiffness of the torsion bars, allowing for higher resonance frequencies
Data Source
AI summary
A light deflector includes: a movable portion; a support having one end connected to the movable portion to elastically support the movable portion, the support including a support thick portion; a drive beam connected to the other end of the support to deform the support to cause the movable portion to oscillate about an oscillation axis; a connecting portion connecting the other end of the support to the drive beam, the connecting portion including a connecting thick portion; and a support frame supporting the drive beam via a fixing portion. The support thick portion and the connecting thick portion are connected to each other.


