MEMS Transmissive Light Valve on SOI Substrate
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Solution Overview
Problem
Conventional liquid crystal display devices have low light utilization rate, small view-angle range, complex structure, and high cost, and the manufacturing process of display panels is not compatible with semiconductor manufacturing processes, leading to poor compatibility and increased costs.
Innovation Solution
A method for forming a display device with a MEMS transmissive light valve using a multilayer semiconductor substrate, where a light guide opening is formed, and a MEMS transmissive light valve is electrically connected to an interconnection layer, surrounded by an interlayer dielectric layer, and a transparent backplane is formed on top, allowing for integration of the driving circuit and MEMS transmissive light valve on a silicon on insulator (SOI) substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If TFT and MEMS transmissive light valve are formed on glass substrate with separate driving circuit chip, then display function is achieved, but device size increases and manufacturing compatibility deteriorates
Solution Approach 1:
The patent merges the driving circuit and MEMS transmissive light valve onto a single semiconductor substrate, eliminating the need for separate driving circuit chips. This integration is achieved by forming both the driving circuit and the light valve on the same semiconductor substrate using compatible manufacturing processes, thereby reducing device complexity and improving manufacturing compatibility.
Solution Approach 2:
The semiconductor substrate serves multiple functions simultaneously: it acts as the base for the driving circuit, the support for the MEMS transmissive light valve, and the platform for light guidance. This multi-functionality eliminates the need for separate glass substrates and driving circuit chips, resolving the contradiction between manufacturing compatibility and device complexity.
2Loss of energy
If conventional liquid crystal layers with polarizer, color filter and ITO electrode are used, then display is achieved, but light utilization rate decreases and cost increases
Solution Approach 1:
The patent extracts and removes the unnecessary components (polarizer, color filter, and ITO electrode) from the display structure, retaining only the essential MEMS transmissive light valve on a semiconductor substrate. This extraction eliminates the light loss associated with conventional liquid crystal layers while simplifying the overall device structure.
Solution Approach 2:
The patent replaces the conventional liquid crystal mechanical system with a MEMS-based transmissive light valve system. This substitution eliminates the need for polarizers and color filters, thereby improving light utilization rate while reducing structural complexity through the use of semiconductor manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the performance and reliability of the driving circuit, simplifies the manufacturing process, reduces device size and cost, and enhances alignment accuracy, while ensuring compatibility with semiconductor manufacturing processes.
Implementation Method 1
with the development of Micro Electro Mechanical Systems (MEMS) technology, MEMS transmissive light valves are used to replace liquid crystal layers in display devices
Implementation Method 2
the driving electrode 60 and the sensing electrode 50 drive the movable grating 40 to move in the horizontal direction
Data Source
AI summary
A display device having a MEMS transmissive light valve and a method for forming the same are provided. The method includes: providing a multilayer semiconductor substrate comprising a bottom semiconductor layer, a middle buried layer and a top semiconductor layer; forming a light guide opening in the top semiconductor layer; forming at least one MOS device in a remaining part of the top semiconductor layer; forming an interconnection layer and an interlayer dielectric layer on the at least one MOS; forming a MEMS transmissive light valve, which is electrically connected to the interconnection layer, on the light guide opening, where the MEMS transmissive light valve is surrounded by the interlayer dielectric layer; forming a transparent backplane on a top surface of the interlayer dielectric layer; and removing the bottom semiconductor layer.