MEMS Logic Device Torsion Hinge Gate Pivoting

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Solution Overview

Problem

Conventional semiconductor integrated circuits face limitations in high temperature, radiation hardness, and voltage operation, necessitating the development of more robust digital logic elements.

Innovation Solution

A configurable multi-function MEMS logic device utilizing a torsion hinge to pivot a gate with electrically conductive channels and body bias elements, allowing for various digital element functionalities through bias potential applications, and integrated into circuits with hardwired or programmable connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor integrated circuits are used, then manufacturing and integration are straightforward, but they cannot operate reliably at high temperatures, in high-radiation environments, or at high voltages

Engineering Contradiction:
Improveoperation reliability under extreme conditionsVSAvoidoperating condition range
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent replaces conventional semiconductor electronic switches with MEMS (microelectromechanical) switches that use mechanical motion of a gate to control electrical conductivity. The gate physically moves to make or break electrical contact between source and drain contacts, enabling operation in extreme conditions where semiconductor devices fail due to their material properties and manufacturing constraints

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the fundamental operating parameters by using electrostatic actuation to move the gate between open and closed states. This allows the switch to operate at high voltages (beyond typical semiconductor breakdown voltages) and high temperatures where semiconductor materials would fail, achieving adaptability across extreme operating conditions while maintaining reliability

Inventive Principle:
Principle #35Parameter changes

2Temperature

If a MEMS switch structure with moving gate is implemented, then high voltage and temperature operation is enabled, but the device occupies larger substrate area

Engineering Contradiction:
Improvemaximum operating temperatureVSAvoidsubstrate area occupied
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The patent employs a vertically oriented gate structure that moves up and down perpendicular to the substrate plane, rather than requiring lateral movement. This vertical dimension allows the switch contacts to be positioned closely together on the substrate while the gate travels through the vertical space above them, enabling high-temperature operation without proportionally increasing the footprint area

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If multiple digital logic functions are integrated into a single MEMS device, then circuit complexity is reduced and versatility is improved, but device fabrication and configuration become more complex

Engineering Contradiction:
Improvedigital logic function varietyVSAvoidfabrication and configuration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent designs a universal MEMS switch architecture that can be configured to perform multiple digital logic functions (AND, OR, NOT, NAND, NOR, XOR, multiplexing, etc.) by connecting the same basic switch structure to different logic gate circuits. This multi-functionality approach allows a single device type to replace multiple specialized components, reducing overall circuit complexity while maintaining fabrication simplicity through standardized MEMS manufacturing processes

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Speed

If fast switching times are achieved through optimized MEMS design, then signal processing speed is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveswitching speedVSAvoidgate alignment and contact precision
Core Design Contradiction:
SpeedVSManufacturing precision

Solution Approach 1:

The patent incorporates compliance features and stress-engineered structures in the gate and support beams that pre-position the gate for optimal contact alignment before actuation. These preliminary mechanical configurations ensure that when the gate moves during switching, it naturally aligns with the source and drain contacts, achieving fast switching times while tolerating normal manufacturing variations without requiring excessive precision

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high temperature, radiation-hard, and high voltage operation with fast switching times, occupying minimal substrate area and offering versatility in digital circuit configurations.

Implementation Method 1

When a sufficient bias difference is applied between the gate and the first body bias element, the gate pivots on the torsion hinge

Methodology Applied
Scientific EffectElectrostatic actuation: Electrostatics

Data Source

PatentUS8975722B2MEMS device and method of manufacture
Publication Date: 2015.03.10 TEXAS INSTRUMENTS INC
  • US8975722B2 patent drawing
  • US8975722B2 patent drawing
  • US8975722B2 patent drawing

AI summary

A MEMS logic device comprising agate which pivots on a torsion hinge, two conductive channels on the gate, one on each side of the torsion hinge, source and drain landing pads under the channels, and two body bias elements under the gate, one on each side of the torsion hinge, so that applying a threshold bias between one body bias element and the gate will pivot the gate so that one channel connects the respective source and drain landing pad, and vice versa. An integrated circuit with MEMS logic devices on the dielectric layer, with the source and drain landing pads connected to metal interconnects of the integrated circuit. A process of forming the MEM switch.