MEMS Optical Device with Magnetic Sensor for Accurate Temperature Measurement
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Solution Overview
Problem
Current MEMS optical devices face challenges in forming large focal-plane-arrays due to measurement errors caused by physical contact between temperature sensing and light absorbing mechanisms, leading to inaccurate light detection in imaging and non-imaging applications.
Innovation Solution
A MEMS optical device design featuring a deformable membrane with a magnetic sensing mechanism, where the magnetic sensor is spaced apart from the light absorbing mechanism, allowing for isolated heat generation and improved measurement accuracy, enabling the formation of large focal-plane-arrays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If thermos-sensor is physically embedded into heat-plate to achieve accurate temperature measurement, then measurement precision is improved, but device complexity increases and large array formation becomes difficult
Solution Approach 1:
The device is divided into two separate components: a light-absorbing mechanism (heat plate) and a detecting mechanism (magnetic sensor with magnetic source), which are spatially separated rather than physically embedded together. This segmentation allows independent optimization of each component while avoiding the complexity of integrated temperature sensors.
Solution Approach 2:
The traditional thermal contact measurement system (thermos-sensor physically touching heat-plate) is replaced with a magnetic field-based detection system. A magnetic source attached to the heat-plate interacts with a magnetic sensor, enabling contactless measurement of heat plate temperature through magnetic field changes, thereby eliminating the need for physical sensor embedding.
2Measurement precision
If thermos-sensor is physically embedded into heat-plate for accurate measurement, then measurement precision is improved, but productivity decreases due to difficulty in forming large arrays
Solution Approach 1:
By separating the light-absorbing mechanism and detecting mechanism into independent components, each can be manufactured and optimized separately, then assembled into arrays. This modular approach enables scalable production of large FPA arrays without the manufacturing complexity associated with embedded temperature sensors.
Solution Approach 2:
Replacing the mechanical/thermal contact system with a magnetic field interaction system enables non-contact measurement, simplifying the structure and facilitating mass production of large arrays. The magnetic coupling allows for easier integration and testing during manufacturing processes.
3Measurement precision
If detecting current is driven through thermos-sensor to measure voltage drop, then temperature measurement is achieved, but heat is generated and mixed with incident light heat causing measurement errors
Solution Approach 1:
The electrical measurement system (driving current through thermos-sensor) is replaced with a magnetic field-based measurement system. The magnetic source attached to the heat-plate generates a magnetic field that is detected by the magnetic sensor, allowing temperature measurement without injecting electrical current that would generate unwanted heat.
Solution Approach 2:
A magnetic source acts as an intermediary between the heat-plate and the magnetic sensor. Instead of directly measuring temperature through electrical contact, the magnetic source translates thermal state into magnetic field changes, which are then detected by the sensor without introducing additional heat.
4Measurement precision
If thermos-sensor is physically embedded into heat-plate, then measurement precision is improved, but ease of manufacture decreases for large arrays
Solution Approach 1:
Dividing the device into separate light-absorbing and detecting mechanisms simplifies the manufacturing process. Each component can be fabricated using standard MEMS techniques independently, then assembled into arrays, avoiding the complex procedures required to embed temperature sensors during array fabrication.
Solution Approach 2:
The replacement of thermal contact sensors with magnetic field sensors simplifies the manufacturing workflow. Magnetic sources and sensors can be integrated using standard MEMS deposition and patterning techniques, eliminating the need for specialized sensor embedding processes that complicate large array fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases measurement accuracy by isolating heat generated by the sensing current from the light absorbing mechanism, facilitating the creation of large focal-plane-arrays suitable for various applications like spectrometry and lidar.
Implementation Method 1
a magnetic sensor whose resistance is capable of changing according to the magnetic field provided by the magnetic source
Implementation Method 2
a deformable membrane capable of absorbing light
Implementation Method 3
Temperature of heat plate 102 is elevated after being exposed to the incident light of specific wavelength
Data Source
AI summary
A MEMS optical device and an array composed thereof are disclosed herein, wherein the MEMS optical device comprises a light absorbing element, a deforming element, and a magnetic detector, wherein the magnetic detector comprises a magnetic source and a magnetic sensor.