MEMS Magnetometer Electrical Interconnections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
MEMS magnetometers require large element sizes or high electrical currents to sense magnetic forces, making them unsuitable for mobile devices due to size and power consumption constraints, and existing fabrication processes are complex and costly, increasing process risks.
Innovation Solution
A microelectromechanical system device with electrical interconnections is developed, featuring a mass with an insulation layer and conductive through holes that connect conductive layers without a cross-line structure, allowing for independent electrical paths and reducing the need for additional process steps and materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single conductive coil design is adopted, then the device structure is simple, but large element size or large electrical current is required which is unsuitable for mobile devices
Solution Approach 1:
The patent divides the mass into multiple conductive layers separated by insulation layers, with each layer containing partial coil structures. This segmentation allows the magnetic sensing function to be distributed across multiple smaller components, reducing the element size while maintaining the overall sensing capability through the combined effect of all layers.
Solution Approach 2:
The patent transitions from a single-plane coil structure to a multi-layer three-dimensional configuration. By stacking multiple conductive layers vertically with insulation layers in between, the coil structure extends in the vertical dimension, enabling compact design that reduces the horizontal element size while preserving the magnetic sensing function through the cumulative contribution of all layers.
2Measurement precision
If multiple conductive coils are used, then magnetic sensing capability is improved, but cross-line structures are required which increase process complexity and cost
Solution Approach 1:
The patent segments the electrical interconnection function by providing separate conductive through-holes for different conductive layers, eliminating the need for complex cross-line structures. Each through-hole independently connects corresponding conductive portions across insulation layers, simplifying the fabrication process while maintaining multiple independent coil structures for improved magnetic sensing precision.
Solution Approach 2:
The patent introduces conductive through-holes as intermediary elements that facilitate electrical connection between different conductive layers without requiring complex cross-line structures. These through-holes act as simple mediators that pass electrical signals vertically through the insulation layers, reducing process complexity while enabling multiple coil structures for enhanced sensing capability.
3Ease of manufacture
If traditional cross-line structures are used for electrical connections, then electrical interconnection is achieved, but additional process steps and materials are required which increase process cost and risks
Solution Approach 1:
The patent merges the electrical connection function with the existing multi-layer structure by integrating conductive through-holes directly into the stacking sequence of conductive layers and insulation layers. This consolidation eliminates the need for separate cross-line structure fabrication processes, reducing the number of process steps and materials required while achieving reliable electrical interconnection between multiple coil structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of compact, low-power MEMS devices that can efficiently sense magnetic forces without the complexity and cost of traditional cross-line structures, enhancing their suitability for mobile applications.
Implementation Method 1
an electrical current flows through a coil on a twist plate. A magnetic field B will induce a Lorentz force F, and the Lorentz force F will drive the twist plate to rotate
Data Source
AI summary
A microelectromechanical system device including anchors and mass is provided. Electrical interconnections are formed on the mass by using a insulation layer of mass, an electrical insulation trench and conductive through hole. The electrical interconnections replace the cross-line structure without adding additional processing steps, thereby reducing the use of the conductive layer and the electrical insulation layer. A method for fabricating the microelectromechanical system device is also provided.