MEMS Micromirror Module Automated Optical Alignment
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Solution Overview
Problem
The existing methods for assembling micromirrors in electronic modules are slow, prone to errors, and result in suboptimal productivity and yield.
Innovation Solution
An electronic module comprising two reflectors, specifically MEMS micromirrors, integrated with a frame that includes supporting portions and connection portions, allowing for automatic alignment and assembly without human intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micromirrors are assembled manually in electronic apparatuses, then alignment can be performed with human judgment, but the assembly process is slow and productivity is reduced
Solution Approach 1:
The patent replaces manual mechanical alignment with an automated optical alignment system. The system uses a laser beam as a reference, with detection means that automatically measure the position of micromirror surfaces relative to the optical axis. This substitution of manual mechanical operations with automated optical-mechanical systems resolves the contradiction by enabling both high precision alignment and rapid assembly.
Solution Approach 2:
The alignment system enables the micromirrors to be self-aligned through automated detection and adjustment. The detection means automatically measure surface positions and the adjustment means automatically reposition the micromirrors, eliminating the need for continuous human intervention. This self-service capability maintains high alignment precision while dramatically improving assembly speed and productivity.
2Ease of operation
If manual assembly methods are used, then flexibility in handling complex alignments is maintained, but errors increase and yield decreases
Solution Approach 1:
The patent implements a feedback-controlled alignment system where detection means continuously monitor the position of micromirror surfaces relative to the laser optical axis. The adjustment means receives feedback from these measurements and automatically makes corrections. This closed-loop feedback mechanism eliminates human errors while maintaining the flexibility needed for complex alignments, thereby improving assembly yield and reliability.
3Productivity
If automated assembly is implemented, then productivity increases, but alignment precision may deteriorate without proper guidance systems
Solution Approach 1:
The patent employs a laser beam as a pre-established optical reference before the micromirrors are positioned. The laser defines the desired optical axis in advance, and the automated detection and adjustment means use this pre-established reference to guide the alignment process. This preliminary action ensures that automated assembly maintains high precision while achieving increased throughput.
Solution Approach 2:
The patent replaces manual alignment operations with an automated system based on optical references and electronic control. The laser provides a stable optical reference, detection means convert positional information into electronic signals, and adjustment means execute precise repositioning. This mechanical-to-optical-electronic substitution enables automated high-precision alignment at increased speeds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient, error-free, and cost-effective assembly of micromirrors, improving productivity and yield by allowing automatic mounting of the module in electronic apparatuses.
Implementation Method 1
alignment of the two micromirrors is carried out on the basis of a laser beam serving as a reference
Implementation Method 2
detection means arranged to detect a position of a first surface of the first micromirror and a position of a second surface of the second micromirror
Data Source
AI summary
An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.


