MEMS Microphone Assembly With Configurable Acoustic Paths
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Solution Overview
Problem
Existing microphone assemblies require different MEMS microphone elements for various applications, such as hands-free communication and active noise cancellation, due to differing frequency response and directivity needs, leading to inefficiencies and increased costs.
Innovation Solution
A single MEMS microphone assembly design that can be modified through structural and geometric adjustments in the housing/casing to provide different frequency responses and directivities, using a single common microphone element model with features on the module level, such as adjustable acoustic paths and resistance elements, to achieve uni-directional, omni-directional, and cardioid patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different MEMS microphone elements are used for various applications (hands-free communication, active noise cancellation), then frequency response and directivity requirements are met, but device complexity and manufacturing costs increase
Solution Approach 1:
The patent implements a single MEMS microphone element that can serve multiple applications by configuring different acoustic paths and resistance elements. The same physical microphone element can achieve uni-directional, omni-directional, and cardioid patterns through structural modifications in the housing and acoustic pathways, eliminating the need for multiple specialized microphone elements for different applications.
Solution Approach 2:
The patent employs adjustable acoustic paths and resistance elements that can be configured dynamically to change the microphone's directivity pattern and frequency response. By making the acoustic pathways and resistance elements adjustable rather than fixed, the system can adapt its characteristics for different applications without replacing the entire microphone element.
2Reliability
If multiple MEMS microphone elements are manufactured for different applications, then application-specific performance is optimized, but production costs increase
Solution Approach 1:
The patent creates a universal MEMS microphone element design that can be used across multiple applications. By designing a single microphone element that can achieve different directivity patterns (uni-directional, omni-directional, cardioid) and frequency responses through configurable acoustic paths and resistance elements, the system eliminates the need to manufacture multiple specialized microphone elements, thereby reducing production costs while maintaining application-specific performance.
3Adaptability or versatility
If structural and geometric adjustments are made in the housing to modify frequency response and directivity, then a single microphone element serves multiple applications, but device complexity increases
Solution Approach 1:
The patent divides the acoustic system into separate, configurable components including distinct acoustic paths (first acoustic path for one side of the diaphragm, second acoustic path for the other side) and separate resistance elements. This segmentation allows each component to be independently designed and adjusted to achieve different directivity patterns and frequency responses, making the system more adaptable while keeping individual components relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a single microphone assembly to meet the requirements of multiple applications by adjusting frequency responses and directivities without needing multiple MEMS elements, enhancing flexibility and reducing production costs.
Implementation Method 1
The first PCB defines a first acoustic path positioned below the second PCB and the MEMS transducer. The enclosure defines a first acoustic opening that is positioned directly below the first acoustic path to enable an audio input signal to pass through the first audio port and to an underside of the MEMS transducer.
Implementation Method 2
a micro-electro-mechanical systems (MEMS) transducer positioned in the sub-casing
Data Source
AI summary
In at least one embodiment, a microphone assembly including an enclosure, a first printed circuit board (PCB) and a microphone assembly is provided. The microphone assembly includes a sub-casing, a micro-electro-mechanical systems (MEMS) transducer, and a second PCB. The MEMS transducer positioned in the sub-casing and the second PCB supports the MEMS transducer. The first PCB defines a first acoustic path positioned below the second PCB and the MEMS transducer. The second PCB defines a first audio port positioned directly below the MEMS transducer. The enclosure defines a first acoustic opening that is positioned directly below the first acoustic path to enable an audio input signal to pass through the first audio port and to an underside of the MEMS transducer. The enclosure defines a second acoustic opening that is positioned at a distance of between 3 to 30 mm from the first acoustic opening.