MEMS Microphone Back Cavity Overlap with Vibration Membrane

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Solution Overview

Problem

Current technologies lack integration of micro-electro mechanical microphones and vibration sensors into a single unit, limiting their combined sensing capabilities for sound and vibration signals.

Innovation Solution

A micro-electro mechanical device integrating a casing with a vibration sensor and a micro-electro mechanical microphone, where the back cavity of the microphone overlaps with the vibration membrane assembly, enhancing sound wave-driven membrane vibration and allowing simultaneous sensing of bone conduction vibrations and acoustic signals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If micro-electro mechanical microphone and vibration sensor are integrated into a single unit, then sensing capability is improved, but device complexity increases

Engineering Contradiction:

Improvesensing capabilityVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines a micro-electro mechanical microphone and a vibration sensor into a single integrated device housing. The microphone assembly and vibration sensor are positioned adjacent to each other within the same housing, allowing simultaneous detection of acoustic signals and vibration signals from the same source, thereby improving sensing capability while managing device complexity through unified integration.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated device performs multiple functions by combining acoustic signal detection (microphone) and vibration signal detection (vibration sensor) in a single unit. This multi-functional design allows the device to capture both airborne sound waves and structure-borne vibrations simultaneously, enhancing overall sensing versatility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Measurement precision

If back cavity of microphone is enlarged to overlap with vibration membrane assembly, then microphone sensitivity is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvemicrophone sensitivityVSAvoidmanufacturing precision

Core Design Contradiction:

Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent extends the back cavity of the microphone in the vertical dimension to overlap with the vibration membrane assembly. This dimensional extension increases the back cavity volume without significantly increasing the horizontal footprint, thereby improving microphone sensitivity while managing manufacturing precision requirements through vertical space utilization.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The back cavity of the microphone is designed to spatially overlap with and effectively nest around the vibration membrane assembly. This nested arrangement allows the back cavity to encompass the membrane assembly area, increasing acoustic compliance and microphone sensitivity while maintaining compact overall device dimensions.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves the sensitivity of the microphone and the overall sensing capability of the device by enabling effective integration of sound and vibration sensing, with adjustable cavity designs for customizable performance.

Implementation Method 1

sound wave-driven membrane vibration

Methodology Applied

Scientific EffectResonance: Resonance

Implementation Method 2

back cavity of the micro-electro mechanical microphone...at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly...enhancing sound wave-driven membrane vibration

Methodology Applied

Scientific EffectAcoustic pressure-driven displacement: Acoustic Radiation Pressure

Data Source

PatentUS11800298B2Micro-electro mechanical device with vibration sensor and micro-electro mechanical microphone

Publication Date: 2023.10.24 MERRY ELECTRONICS (SHENZHEN) CO LTD

AI summary

A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.