MEMS Microphone Back Chamber Volume Enlargement
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Solution Overview
Problem
The challenge in MEMS microphone packages is to enhance sensitivity while scaling down their size, as the smaller volume of back chambers leads to decreased sensitivity due to the miniaturization of electronic products.
Innovation Solution
The MEMS microphone package design includes a substrate with a hollow chamber and multiple openings that communicate with it, along with a transducer, integrated circuit chip, and housing, where bonding layers and cavities are strategically placed to increase the volume of the back chamber, thereby enhancing sensitivity. This involves a substrate with first and second openings, a transducer with a first cavity, and an integrated circuit chip with a second cavity, both communicating with the hollow chamber, and optionally, a frame or lid to further increase the back chamber volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of MEMS microphone package is scaled down to meet smaller electronic products, then the size of the microphone package is reduced, but the volume of back chamber becomes small and sensitivity decreases
Solution Approach 1:
The patent implements nesting by placing the transducer cavity inside the substrate hollow chamber, and the integrated circuit chip cavity inside the substrate hollow chamber. This nested arrangement allows multiple cavities to occupy space efficiently within the compact package, enabling the back chamber volume to be enlarged without increasing the overall package size, thus maintaining sensitivity while achieving miniaturization.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by creating multiple cavities at different levels and positions within the substrate. The transducer cavity, integrated circuit chip cavity, and substrate hollow chamber are arranged in different spatial dimensions, allowing the back chamber volume to be effectively enlarged through vertical and lateral space utilization rather than simply increasing the footprint area.
2Reliability
If multiple cavities are added to increase back chamber volume, then sensitivity is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functional elements into a single substrate structure. The substrate integrates the hollow chamber, the transducer cavity, and the integrated circuit chip cavity within one component. This merging approach allows multiple cavities to be created without proportionally increasing overall structural complexity, as they are all part of the same substrate assembly rather than separate components.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides the hollow chamber for acoustic isolation, contains the transducer cavity for sound transduction, and houses the integrated circuit chip cavity for signal processing. This multi-functionality reduces the need for separate structural elements, thereby limiting the increase in device complexity while achieving the desired back chamber volume enlargement.
Data Source
AI summary
A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.