MEMS Microphone Back Volume Apertures for Frequency Response Shaping

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Solution Overview

Problem

MEMS microphones exhibit non-uniform sensitivity across various frequencies, failing to meet performance specifications due to inconsistent frequency response.

Innovation Solution

The acoustic sensor assembly incorporates a housing with a back volume divided into two portions, acoustically coupled by one or more apertures that shape the frequency response by varying acoustic impedance, allowing for increased or decreased sensitivity at specific frequencies through aperture configuration and placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional MEMS microphone structure is used, then the device achieves low cost and small size, but the frequency response is non-uniform and sensitivity varies across frequencies

Engineering Contradiction:
Improvefrequency response uniformityVSAvoidhousing structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The back volume of the housing is divided into two separate portions (first back volume portion and second back volume portion) that are acoustically coupled through apertures. This segmentation allows independent acoustic treatment of each portion, enabling frequency response shaping while maintaining a relatively simple overall housing structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Apertures are strategically positioned and sized in specific locations within the housing to create localized acoustic impedance variations. These apertures are configured to provide different acoustic properties at different frequencies, allowing sensitivity adjustment at specific frequency ranges without affecting the entire frequency spectrum uniformly.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the back volume is increased to improve low-frequency response, then sensitivity at low frequencies improves, but the overall device size increases

Engineering Contradiction:
Improvelow-frequency sensitivityVSAvoidhousing volume
Core Design Contradiction:
Manufacturing precisionVSVolume of moving object

Solution Approach 1:

The second back volume portion is positioned adjacent to and acoustically coupled with the first back volume portion through apertures in the housing walls. This nested arrangement allows the acoustic benefits of a larger total back volume to be achieved while keeping the physical footprint compact, as the two portions are efficiently packed within the housing boundaries.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the frequency response of MEMS microphones, improving sensitivity at desired frequencies, thereby meeting performance specifications and providing more desirable acoustic performance.

Implementation Method 1

One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly

Methodology Applied
Scientific EffectAcoustic impedance: Acoustics

Data Source

PatentUS12108204B2Acoustic sensor assembly having improved frequency response
Publication Date: 2024.10.01 KNOWLES ELECTRONICS LLC
  • US12108204B2 patent drawing
  • US12108204B2 patent drawing
  • US12108204B2 patent drawing

AI summary

An acoustic sensor assembly includes a housing having an external-device interface and a sound port to an interior of the housing. An electro-acoustic transducer and an electrical circuit are disposed within the housing. The electro-acoustic transducer separates the interior into a front volume and a back volume, where the sound port acoustically couples the front volume to an exterior of the housing. The back volume includes a first portion and a second portion. The electrical circuit is electrically coupled to the electro-acoustic transducer and to the external-device interface. One or more apertures acoustically couple the first and second portions of the back volume and are structured to shape a frequency response of the acoustic sensor assembly.