MEMS Microphone Chip With Notched Support Column
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional MEMS microphones face reduced yield due to dust contamination and damage from obstructed airflow during cleaning, which affects the connection portion, backplate, or vibration diaphragm, leading to malfunction.
Innovation Solution
The MEMS microphone chip design includes a substrate with a back chamber and support column connected via a connection portion that features a through hole or notch, allowing communication between opposite sides, reducing airflow obstruction and enhancing the anti-blowing capability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the connection portion partitions the back chamber to support the backplate, then the structural support is improved, but the airflow obstruction during cleaning causes damage to the connection portion, backplate or vibration diaphragm
Solution Approach 1:
The connection portion is segmented by forming a through hole or notch through its thickness direction, dividing it into first and second connection portions. This segmentation allows airflow to pass through while maintaining structural support functionality, resolving the contradiction between support strength and airflow obstruction.
Solution Approach 2:
The connection portion is designed with a porous-like structure containing a through hole or notch, enabling it to be permeable to airflow while retaining its mechanical support function. This allows the connection portion to simultaneously provide structural support and allow airflow passage during cleaning processes.
2Ease of manufacture
If air gun is used to clean dust from PCB during assembly, then dust removal is improved, but the blown airflow causes local high pressure that damages the connection portion, backplate or vibration diaphragm
Solution Approach 1:
The harmful effect of airflow obstruction is extracted by removing material from the connection portion to create a through hole or notch. This allows the cleaning airflow to pass through the connection portion without building up local high pressure that would damage components, while maintaining the support function.
Solution Approach 2:
The through hole or notch in the connection portion converts the potentially harmful blown airflow into a beneficial cleaning mechanism by allowing air to pass through and carry dust particles away from the back chamber, transforming the cleaning process from harmful to beneficial.
3Strength
If the connection portion is made solid to support the backplate, then the support capability is improved, but the yield is reduced due to damage during blowing process
Solution Approach 1:
The connection portion is divided into first and second connection portions by the through hole or notch, maintaining support capability while enabling airflow passage. This segmentation resolves the contradiction between support strength and manufacturing yield by allowing successful assembly without damage during the blowing process.
Data Source
AI summary
Provided are a MEMS microphone chip and an MEMS microphone. The MEMS microphone chip comprises a substrate, a backplate and a vibration diaphragm, the backplate and the vibration diaphragm constituting two electrodes of a capacitor respectively, the backplate and the vibration diaphragm being suspended above the substrate, the backplate being located between the substrate and the vibration diaphragm, and the substrate being provided with a back chamber and a support column, the support column being connected to a side wall of the back chamber via a connection portion, a through hole or a notch being formed in the connection portion through its thickness direction, to allow spaces at opposite sides of the connection portion to communicate with each other; and the support column being configured to support the backplate.