MEMS Microphone Diaphragm Hardness Control via Voltage
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Solution Overview
Problem
MEMS microphones have a limited acoustic pressure measurement range, struggling to detect both loud and low sounds effectively, necessitating a solution to enhance their sensitivity and dynamic range.
Innovation Solution
A microphone design featuring a diaphragm with a displacement adjusting layer and a fixing layer, where the hardness of the diaphragm is adjusted by applying voltage based on input sound pressure, utilizing a structure with multiple displacement adjusting units and a sacrificial layer to improve acoustic pressure measurement capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the sensitivity of the MEMS microphone is increased, then the detection capability of low sound is improved, but the acoustic overload point is reduced which limits detection of loud sound
Solution Approach 1:
The patent applies the dynamics principle by making the diaphragm's mechanical properties adjustable through electrical voltage. The displacement adjusting layer changes the stiffness of the diaphragm dynamically based on applied voltage, allowing the microphone to adapt its sensitivity characteristics. This enables the system to optimize performance for different sound pressure levels, resolving the contradiction between detecting low sounds and handling loud sounds.
Solution Approach 2:
The patent implements parameter changes by modifying the physical state of the diaphragm through voltage application. The displacement adjusting layer alters the stiffness parameter of the diaphragm based on electrical input, which directly changes the mechanical resonance and sensitivity characteristics. This allows the microphone to transition between high-sensitivity mode for quiet sounds and low-sensitivity mode for loud sounds, expanding the acoustic pressure measurement range.
2Adaptability or versatility
If the sensitivity of the MEMS microphone is decreased, then the acoustic overload point is increased for detecting loud sound, but the detection capability of low sound deteriorates
Solution Approach 1:
The same dynamics principle works in reverse to address this contradiction. By adjusting the voltage applied to the displacement adjusting layer, the system can reduce diaphragm stiffness to increase the acoustic overload point for loud sound detection, or increase stiffness to improve sensitivity for low sound detection. This dynamic adjustment capability allows the microphone to adapt to different acoustic environments.
Solution Approach 2:
The parameter changes principle is applied by using voltage to modify the stiffness parameter of the diaphragm. When higher voltage is applied, the diaphragm becomes stiffer, increasing the acoustic overload point for loud sound detection. When lower voltage is applied, the diaphragm becomes more compliant, improving sensitivity for low sound detection. This electrical control of mechanical parameters resolves the trade-off between these two performance aspects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a wider acoustic pressure measurement range, allowing for effective detection of both high and low sound levels by dynamically adjusting the diaphragm's hardness in response to input acoustic signals, thereby enhancing the microphone's sensitivity and dynamic range.
Implementation Method 1
the hardness of the diaphragm is adjusted by applying voltage based on input sound pressure
Data Source
AI summary
A microphone, a manufacturing method and a control method of the microphone are provided. The microphone includes an insulating layer bonded to a surface of a substrate in which a sound inlet is formed and includes a plurality of sound apertures. A diaphragm is formed at a position that corresponds to the sound inlet of the substrate on an upper surface of the insulating layer. A displacement adjusting layer is disposed in a circumference of the diaphragm on the upper surface of the insulating layer and is configured to adjust hardness of the diaphragm based on an input sound. A fixing layer is disposed on the diaphragm and the displacement adjusting layer while spaced apart from the diaphragm and the displacement adjusting layer.


