MEMS Microphone Dual Electromagnetic Shielding
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Solution Overview
Problem
MEMS microphones are susceptible to electromagnetic interference from environmental waves, which degrades sound reception quality due to their design and structure.
Innovation Solution
The implementation of a MEMS microphone device with dual electromagnetic shielding covers, where the first and second electromagnetic shielding covers form accommodating spaces for the MEMS chip and ASIC chip, providing dual protection by being grounded through the circuit boards, thereby enhancing electromagnetic shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a MEMS microphone is designed with small size and low weight, then it offers advantages in portability and integration, but it becomes more susceptible to electromagnetic interference from environmental waves
Solution Approach 1:
The patent implements a nested shielding structure where an inner electromagnetic shielding can is placed inside an outer electromagnetic shielding can. The inner can shields the MEMS microphone diaphragm and associated circuitry, while the outer can provides additional shielding layers. This multi-layer nested configuration creates progressively better electromagnetic isolation while maintaining the compact form factor required for portable devices.
Solution Approach 2:
The electromagnetic shielding cans act as intermediary structures between the MEMS microphone and the external electromagnetic environment. These shielding cans, made of conductive materials and connected to ground, serve as mediators that intercept and redirect electromagnetic waves away from the sensitive microphone components, thereby protecting the small lightweight device without requiring significant size increase.
2Reliability
If electromagnetic shielding is added to protect against interference, then sound reception quality improves, but device complexity increases
Solution Approach 1:
The patent combines the electromagnetic shielding function with the structural housing of the MEMS microphone module. The shielding cans are integrated into the existing device architecture, serving dual purposes as both protective structures and electromagnetic barriers. This merging approach provides comprehensive shielding against electromagnetic interference while avoiding the need for separate, additional shielding components that would increase overall device complexity.
Solution Approach 2:
The patent optimizes the shielding effectiveness by adjusting parameters such as the thickness, material composition, and grounding configuration of the shielding cans. By carefully controlling these parameters, the design achieves high sound reception quality and electromagnetic protection without requiring overly complex structures. The inner and outer cans use different grounding arrangements (inner can grounded at one end, outer can at both ends) to maximize shielding efficiency with minimal structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the sound reception quality of MEMS microphones by effectively shielding them from electromagnetic interference, ensuring better performance in electronic devices like smartphones and tablets.
Implementation Method 1
the first electromagnetic shielding cover 12 and the second electromagnetic shielding cover 22 are both adapted to provide electromagnetic shielding protection for electrical components therein
Data Source
AI summary
A micro-electro-mechanical system (MEMS) microphone device is provided in the present disclosure. The MEMS microphone device includes a first electromagnetic shielding cover defining a first accommodating space; a second electromagnetic shielding cover received in the first accommodating space and defining a second accommodating space; a MEMS chip and an application specific integrated circuit (ASIC) chip received in the second accommodating space. The first electromagnetic shielding cover and the second electromagnetic shielding cover cooperatively provide dual electromagnetic shielding protection for the MEMS chip and the ASIC chip.


