MEMS Microphone Package Dual-Surface Carrier Integration
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Solution Overview
Problem
Conventional MEMS microphones face challenges in reducing package size and increasing structural strength due to the need for larger bases to protect components and ensure electrical connections between the back chip, diaphragm chip, and field effect transistor, which complicates fabrication and limits miniaturization.
Innovation Solution
A MEMS microphone package structure featuring a carrier with a first and second surface, an application-specific IC on the first surface, and encapsulants on both surfaces to form a cavity around the microphone chip, enhancing structural strength and simplifying the process by integrating the first and second encapsulants to seal the IC and surround the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a larger base is used to protect components and ensure electrical connections, then structural strength and reliability are improved, but package size increases
Solution Approach 1:
The patent merges the base and back chip into a single integrated structure where the back chip is directly mounted on the base without requiring a separate large base structure. The electrical connections are achieved through direct bonding and conductive paste, eliminating the need for extensive trace routing on a large base. This integration maintains structural strength while significantly reducing the overall package area.
2Reliability
If a larger base is used to ensure electrical connections between components, then connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the electrical connection function from the base structure and implements it through direct bonding techniques. Instead of relying on a large base with complex trace routing, the invention uses direct metal-to-metal bonding and conductive paste to create reliable electrical connections between the back chip, diaphragm chip, and field effect transistor. This simplifies the base structure and reduces fabrication complexity while maintaining connection reliability.
3Reliability
If separate encapsulants are used to seal the IC and surround the chip, then protection reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent combines the sealing function for the IC and the protective enclosure for the microphone chip into a single integrated encapsulant structure. This unified encapsulant is formed in one molding process, eliminating the need for separate sealing and encasing operations. The single encapsulant maintains protection reliability by simultaneously sealing the IC and surrounding the microphone chip, while significantly simplifying the manufacturing process by reducing the number of steps and materials required.
Data Source
AI summary
A MEMS microphone package includes a carrier, an application specific IC, an encapsulant and a microphone chip. The application specific IC and the microphone chip are respectively disposed on first and second surfaces of the carrier, and the application specific IC and the microphone chip are electrically connected to the carrier. The encapsulant includes first and second encapsulants, the first encapsulant is formed on the first surface to seal the application specific IC, the second encapsulant is formed on the second surface to become a cavity and the microphone chip is located at the cavity. Because the application specific IC and the microphone chip are disposed on the first and second surfaces of the carrier, respectively, the second encapsulant surrounds the microphone chip, and the first and second encapsulants are formed at the same time, it can increase the structural strength of package and reduce the process.