MEMS Microphone Package Flip-Chip Mounting
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Solution Overview
Problem
Conventional MEMS microphones using wire bonding technology face challenges with high profile packaging, signal interference, and low I/O pin count, which are inconsistent with current market trends and limitations.
Innovation Solution
A MEMS microphone package employing flip-chip technology to electrically connect the acoustic wave sensor to the substrate, eliminating the need for spare height and incorporating a processor chip and cover plate with solder pads for improved heat dissipation and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If wire bonding technology is used to electrically connect the acoustic wave sensor to the substrate, then the connection is established, but the package height increases due to the need for spare height to accommodate metal wires
Solution Approach 1:
The patent replaces the mechanical wire bonding system with a direct chip-to-substrate electrical connection system. The acoustic wave sensor chip is mounted directly on the substrate with its pads electrically connected to the substrate's conduction parts, eliminating the need for metal wires and the associated height requirement. This substitution resolves the contradiction by removing the mechanical wire bonding component that caused both the height increase and signal interference issues.
2Adaptability or versatility
If wire bonding technology is used to electrically connect the acoustic wave sensor to the substrate, then the connection is established, but the I/O pin count is limited
Solution Approach 1:
The patent replaces the wire bonding system with a direct pad-to-conduction-part electrical connection system. The acoustic wave sensor chip has multiple pads that can be directly connected to multiple conduction parts on the substrate, enabling a higher I/O pin count without the spatial constraints of wire bonding. This allows for greater adaptability and versatility in terms of available I/O connections.
Solution Approach 2:
The patent transitions from the three-dimensional wire bonding approach (requiring vertical space for wire routing) to a two-dimensional planar connection approach where electrical connections are made directly between pads and conduction parts on the substrate surface. This dimensional change eliminates the height requirement while enabling multiple parallel connections for increased I/O pin count.
3Temperature
If wire bonding technology is used, then the acoustic wave sensor can be connected to the substrate, but heat dissipation is insufficient
Solution Approach 1:
The patent replaces the wire bonding thermal conduction path with a direct chip-to-substrate thermal contact path. The acoustic wave sensor chip is mounted directly on the substrate, creating efficient thermal conduction from the chip through its mounting interface to the substrate, which then dissipates heat to the surrounding environment. This direct contact provides superior heat dissipation compared to the thin wire bonding interface.
Data Source
AI summary
A MEMS microphone package includes a substrate including a sound hole, a first conduction part and a second conduction part, a sidewall connected with one end thereof to the substrate and having a conducting line electrically connected to the second conduction part, a cover plate connected to an opposite end of the sidewall and defining a chamber therein and having a solder pad and a fifth contact in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted on the substrate inside the chamber and electrically connected to the first conduction part and the second conduction part, and a acoustic wave sensor mounted on the substrate inside the chamber to face toward the sound hole and electrically connected to the first conduction part using flip-chip technology.