MEMS Microphone Monolithic Mesh Membrane Particle Filter
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Solution Overview
Problem
MEMS microphones face challenges with external particle interference due to open acoustic ports, and existing solutions like mesh-structured back holes complicate manufacturing, degrade performance, and increase costs.
Innovation Solution
A MEMS microphone design featuring a mesh membrane monolithically integrated with the chip, acting as a particle filter between the chip and the acoustic port, manufactured using wafer bonding techniques to ensure reliability and reduce package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a mesh-structured back hole is added at MEMS die level to filter particles, then particle filtering capability is improved, but manufacturing complexity increases and performance degrades
Solution Approach 1:
The patent divides the particle filtering function into two parts: a coarse filter (mesh-structured back hole) and a fine filter (separate fine filter component). This segmentation allows each filter to be optimized independently - the back hole provides structural support and coarse filtering, while the separate fine filter component captures smaller particles without complicating the MEMS die fabrication process.
Solution Approach 2:
The patent introduces a separate fine filter component as an intermediary element between the acoustic port and the MEMS microphone chip. This fine filter component acts as a mediator that captures fine particles before they reach the sensitive diaphragm, while the mesh-structured back hole provides structural support and coarse filtering. This intermediary approach solves the contradiction by adding filtering capability without directly modifying the MEMS die structure.
2Object-affected harmful factors
If a fine filter is added to filter particles, then particle filtering capability is improved, but package size increases
Solution Approach 1:
The patent implements a nested filter structure where the fine filter component is positioned within the housing cavity, nested between the acoustic port and the MEMS microphone chip. The mesh-structured back hole is integrated into the housing structure, creating a compact nested arrangement that provides both coarse and fine filtering without significantly increasing the overall package volume.
Solution Approach 2:
The fine filter component is designed as a thin film structure that provides effective particle filtering with minimal thickness. This thin film approach allows the filter to be integrated into the compact housing cavity without adding significant volume, resolving the contradiction between filtering capability and package size.
3Reliability
If a mesh membrane is integrated with the MEMS chip, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the mesh membrane function into two parts: a mesh-structured back hole integrated with the housing structure and a separate fine filter component. This segmentation allows the mesh back hole to provide structural support and coarse filtering as part of the housing, while the fine filter component can be separately optimized and assembled, reducing overall manufacturing complexity while maintaining reliability.
Solution Approach 2:
The mesh-structured back hole is designed to serve multiple functions simultaneously: it provides structural support for the housing, acts as a coarse particle filter, and creates acoustic pathways. This self-service design reduces the need for additional separate components, improving reliability while managing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thin, effective particle filter that enhances reliability and maintains microphone performance while reducing the overall size of the MEMS microphone device.
Implementation Method 1
the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip
Implementation Method 2
the mesh membrane and the second substrate are bonded to the first substrate by at least one of wafer bonding, fusion bonding and intermediate layer bonding
Data Source
AI summary
A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.