MEMS Microphone Package Molded Interconnect Device Lid
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Solution Overview
Problem
Existing MEMS microphone packages face challenges in achieving equivalent acoustic performance and electronic communication between the top and bottom surfaces, particularly in top-port configurations, where mechanisms for efficient electronic communication are needed to ensure proper acoustic input and shielding.
Innovation Solution
The implementation of a molded interconnect device (MID) lid with integrated electronic circuit traces and conductive shielding, allowing for electronic communication between the lid and substrate through vias and wire bonds, while also providing electromagnetic shielding using a Faraday's cage configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a top-ported MEMS microphone package configuration is used, then acoustic input is improved, but electronic communication between lid and substrate becomes complex
Solution Approach 1:
The patent combines the lid structure with integrated circuit traces and conductive elements directly into the lid itself, merging the mechanical protective function with the electrical communication function into a single integrated component, thereby simplifying the overall electronic communication mechanism
Solution Approach 2:
The patent introduces molded interconnect devices (MID) as an intermediary solution that provides conductive pathways through the lid structure, enabling electronic communication between the lid and substrate without requiring complex external wiring or additional communication mechanisms
2Reliability
If electronic communication mechanisms are added to top-ported packages, then electronic connectivity is improved, but device complexity increases
Solution Approach 1:
The lid is merged with conductive traces and MID structures, combining the protective enclosure function with the electrical interconnect function into a single integrated component, ensuring reliable electronic communication while avoiding additional separate communication mechanisms
Solution Approach 2:
The lid serves multiple functions simultaneously: it provides mechanical protection, acoustic sealing, and electrical interconnection through integrated conductive traces and MID structures, eliminating the need for separate dedicated communication components
3Object-affected harmful factors
If conductive shielding is implemented, then electromagnetic shielding is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive shielding layer is merged with the lid structure and MID manufacturing process, integrating the electromagnetic shielding function into the existing lid fabrication steps, thereby providing EMI protection without requiring separate shielding components or additional manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective electronic communication and improved acoustic performance by ensuring proper sealing and shielding in both top-ported and bottom-ported MEMS microphone packages, enhancing the overall functionality and reliability of the devices.
Implementation Method 1
a conductive shielding layer formed on an interior surface of the lid about a cavity defined by the lid and substrate. The conductive shielding layer is electrically coupled to a ground trace
Data Source
Figure 1A~1B
Figure 1C~2
Figure 3A~3B
AI summary
A MEMS microphone package (300) includes a substrate (305) and a molded lid (307). Conductive lid traces (313) and conductive substrate traces (311) provide for electrical coupling between one or more components (301, 309, 317) mounted on the substrate (305) and one or more components (301, 309, 317) mounted on the lid. Examples for the one or more components are a MEMS microphone die (301), an ASIC (309), and an electrical contact pad (317).