MEMS Microphone Multi-Sensitivity Outputs via Shared Diaphragm

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Solution Overview

Problem

Conventional MEMS devices require multiple units with different sensitivities to meet changing environmental conditions, leading to increased circuit costs and complexity.

Innovation Solution

A MEMS device is designed with a common diaphragm to form at least two sensing capacitors, utilizing multiple backplates and amplifying circuits to generate multiple sensitivity outputs from a single device, allowing for adjustable sensitivity through varying capacitance and operational parameters.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple MEMS devices with different sensitivities are implemented to meet changing environmental conditions, then the system can achieve multiple sensitivity outputs, but the circuit cost and complexity increase

Engineering Contradiction:
Improvemultiple sensitivity outputsVSAvoidcircuit cost
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges multiple sensing functions into a single MEMS device by sharing the diaphragm across multiple backplates. The diaphragm is commonly used to form at least two sensing capacitors with different backplates, enabling multiple sensitivity outputs from one device rather than requiring multiple separate MEMS devices.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The diaphragm serves as a universal component that can work with multiple backplates to provide different sensitivity levels. This multi-functional approach allows a single diaphragm to fulfill multiple sensing roles, adapting to different environmental conditions without requiring separate specialized devices.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple MEMS devices with different sensitivities are implemented, then the system can respond to changing environmental conditions, but the number of components and circuit complexity increase

Engineering Contradiction:
Improveresponse to environmental changesVSAvoidnumber of MEMS devices
Core Design Contradiction:
Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

Multiple sensing capabilities are combined within a single MEMS device structure. The shared diaphragm works with multiple backplates to provide different sensitivity outputs, reducing the total quantity of MEMS devices needed while maintaining the ability to respond to various environmental conditions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sensing function is segmented into multiple backplates that can be independently configured with different sensitivities, while sharing the common diaphragm. This segmentation allows different sensitivity levels to be achieved within a single device rather than requiring multiple complete MEMS devices.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables a single MEMS device to provide multiple sensitivity outputs, reducing circuit costs and complexity while maintaining flexibility in response to environmental changes.

Implementation Method 1

Due to the vibration or displacement of the diaphragm, the capacitance is changed, so as to be converted into electric signals used in subsequent application circuits

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS8934649B1Micro electro-mechanical system (MEMS) microphone device with multi-sensitivity outputs and circuit with the MEMS device
Publication Date: 2015.01.13 SOLID STATE SYST
  • US8934649B1 patent drawing
  • US8934649B1 patent drawing
  • US8934649B1 patent drawing

AI summary

A MEMS device includes substrate having a cavity. A dielectric layer is disposed on a second side of substrate at periphery of the cavity. A backplate structure is formed with the dielectric layer on a first side of the substrate and exposed by the cavity. The backplate structure includes at least a first backplate and a second backplate. The first backplate and the second backplate are electric disconnected and have venting holes to connect the cavity and the chamber. A diaphragm is disposed above the backplate structure by a distance, so as to form a chamber between the backplate structure and the diaphragm. A periphery of the diaphragm is embedded in the dielectric layer. The diaphragm serves as a common electrode. The first backplate and the second backplate respectively serve as a first electrode unit and a second electrode unit in conjugation with the diaphragm to form separate two capacitors.