MEMS Microphone Package With Internal Component Chamber
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Solution Overview
Problem
Conventional MEMS microphones have limited functionality and high manufacturing costs due to their inability to accommodate specific user needs, as they rely on a simple integration of an acoustic wave sensor and ASIC, necessitating costly modifications in wafer manufacturing processes to enhance functionality.
Innovation Solution
A MEMS microphone package design that utilizes an internal chamber for mounting electronic components, including a substrate, sidewall, cover plate, acoustic wave sensor, processor chip, and additional electronic components, allowing for customizable functionality and reduced manufacturing costs by enabling the replacement of different types and functions of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional MEMS microphones use simple integration of acoustic wave sensor and ASIC, then manufacturing cost is reduced, but functionality is limited and cannot meet specific user needs
Solution Approach 1:
The patent divides the microphone system into separate functional modules: acoustic wave sensor, ASIC, and additional electronic components (amplifier, filter, ADC/DAC). These segmented components are mounted on the substrate within the package, allowing independent selection and configuration of components based on specific application requirements without requiring complex wafer-level integration modifications.
Solution Approach 2:
The package structure is designed as a universal platform that can accommodate different types and numbers of electronic components (amplifier, filter, ADC/DAC) depending on the application. The substrate, sidewall, and cover plate form a standardized housing that supports various component configurations, enabling the same basic package to serve multiple functions and applications.
2Adaptability or versatility
If modified wafer manufacturing process is used to increase chip function, then functionality is improved, but manufacturing cost greatly increases
Solution Approach 1:
The patent performs preliminary actions by pre-configuring the package structure with mounting positions and electrical connections during the standard MEMS packaging process. The substrate includes pre-formed pads and conductive structures that are ready to receive and connect to various electronic components, eliminating the need for costly post-manufacturing modifications or specialized wafer processes.
Solution Approach 2:
Instead of modifying the original acoustic wave sensor chip to add functions, the patent uses separate electronic components (amplifier, filter, ADC/DAC) that are mounted and electrically connected to the sensor. This approach copies the functionality of integrated circuits through discrete components, achieving enhanced function without requiring expensive chip redesign or re-manufacturing.
3Adaptability or versatility
If single function MEMS microphones are used, then manufacturing is simple and cost is low, but adaptability to different user needs is poor
Solution Approach 1:
The patent implements a nested structure where electronic components (amplifier, filter, ADC/DAC) are mounted within the package housing formed by the substrate, sidewall, and cover plate. The acoustic wave sensor is positioned within the acoustic cavity, and all components are integrated within the compact package structure, achieving high functionality in a space-efficient nested arrangement.
Solution Approach 2:
The patent merges the acoustic wave sensor, ASIC, and additional electronic components (amplifier, filter, ADC/DAC) into a single integrated package. The substrate serves as a common mounting platform for all components, and electrical connections are established through conductive structures on the substrate and wiring, combining multiple functions into one unified device.
Data Source
AI summary
A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.