MEMS Microphone Recess Design for Back Volume

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

MEMS microphones face limitations in sensitivity due to the space occupied by the MEMS device and integrated circuit, which restricts the back volume and thus the performance of the microphone.

Innovation Solution

Creating a recess in the substrate to house the MEMS device and/or integrated circuit, thereby increasing the back volume without occupying additional space, allowing for improved sensitivity and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of stationary object

If the MEMS device and integrated circuit are disposed in a flat substrate configuration, then the assembly is compact and easy to manufacture, but the back volume is reduced which limits sensitivity

Engineering Contradiction:
Improveback volumeVSAvoidsubstrate structure
Core Design Contradiction:
Volume of stationary objectVSDevice complexity

Solution Approach 1:

The patent introduces a recess into the substrate, transitioning from a flat two-dimensional surface to a three-dimensional structure with depth. This dimensional change creates additional back volume without increasing the overall footprint of the device, effectively resolving the contradiction between compactness and sensitivity enhancement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The MEMS device and integrated circuit are nested within the recess of the substrate, utilizing the vertical space created by the recess. This nesting approach allows components to be housed within the substrate structure itself, maximizing the use of available space and increasing back volume without proportionally increasing device complexity.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Measurement precision

If the back volume is increased to improve sensitivity, then the microphone performance is enhanced, but the space required for components increases

Engineering Contradiction:
ImprovesensitivityVSAvoidcomponent space
Core Design Contradiction:
Measurement precisionVSVolume of stationary object

Solution Approach 1:

By creating a recess with depth, the patent exploits the third dimension (vertical space) to increase back volume. This allows sensitivity to be improved without proportionally increasing the horizontal footprint or overall component space requirements, as the additional volume is achieved through vertical integration rather than lateral expansion.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The increased back volume results in enhanced sensitivity and transduction efficiency of the MEMS microphone, as demonstrated by the correlation between increased back volume and improved sensitivity in the provided graphs.

Implementation Method 1

sound energy enters through a sound port and vibrates a diaphragm and this action creates a corresponding change in electrical potential (voltage) between the diaphragm and a back plate disposed near the diaphragm

Methodology Applied
Scientific EffectCapacitive sensing: Capacitance

Data Source

PatentUS9467785B2MEMS apparatus with increased back volume
Publication Date: 2016.10.11 KNOWLES ELECTRONICS LLC
  • US9467785B2 patent drawing
  • US9467785B2 patent drawing
  • US9467785B2 patent drawing

AI summary

A microelectromechanical system (MEMS) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity. The base forms a recess and the recess has dimensions and a shape so as to hold a MEMS die. The MEMS die includes a diaphragm and back plate.