MEMS Microphone Handling via Shaped Covering Layer
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Solution Overview
Problem
MEMS microphones face difficulties in handling due to their small and terraced surface, making assembly on a printed circuit board challenging, especially when using a vacuum nozzle.
Innovation Solution
A microphone design featuring a shaped covering material that forms a rectangular cuboid shape with a flat surface, allowing easier handling, and a method involving a covering layer and sound opening for improved assembly and sealing, including the use of thermosetting or thermoplastic resin and metallization layers for protection and sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a vacuum nozzle is used to handle the MEMS device, then assembly can be performed, but the handling becomes difficult due to the small and terraced surface of the element
Solution Approach 1:
The patent applies this principle by transitioning from a two-dimensional terraced surface to a three-dimensional rounded geometry. The covering layer is designed with a rounded outer surface that protrudes from the substrate plane, creating a convex shape that provides a larger contact area for the vacuum nozzle and improves handling characteristics while maintaining the underlying MEMS structure.
2Reliability
If the transducer element is flip-chip mounted on a substrate and covered by a covering layer, then excellent electro-acoustical properties are achieved, but the surface remains small and terraced making handling difficult
Solution Approach 1:
The patent employs this principle by using a thin covering layer that conformally covers the flip-chip mounted transducer element. This covering layer is designed with a rounded outer surface that provides improved handling characteristics while the thin film structure maintains the electro-acoustical performance of the underlying transducer element through minimal interference.
3Reliability
If the covering layer is designed to form a seal with the substrate, then sealing performance is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent applies this principle by merging the sealing function with the covering layer structure. The covering layer is designed to simultaneously serve as both the protective cover and the sealing element, eliminating the need for separate sealing components. The rounded geometry of the covering layer creates an interference fit with the substrate, providing effective sealing through the combined structural design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances handling and assembly of microphones by providing a flat surface for easier vacuum nozzle handling and ensures effective sealing and electromagnetic interference protection, improving the microphone's integration into devices like mobile phones.
Implementation Method 1
the surface of the element is very small and furthermore terraced. Therefore, the handling by the vacuum nozzle is difficult
Implementation Method 2
The metallization layer protects the transducer element against electromagnetic interference (EMI)
Implementation Method 3
The metallization layer protects the transducer element against electromagnetic interference (EMI)
Implementation Method 4
the sealing ring can form a sealed connection between the sound opening of the microphone and a sound opening in the cover of the mobile phone
Data Source
AI summary
A method of manufacturing a microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed.