MEMS Microphone Substrate Bonding for Compact Packaging
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Solution Overview
Problem
The existing MEMS microphone packaging process is complex, large in size, and costly due to the separate manufacturing of CMOS circuits and MEMS microphones, which are then wire-bonded together, resulting in a cumbersome and expensive assembly.
Innovation Solution
A MEMS microphone is formed by bonding a first base-structure with a MEMS microphone component and a conductive bonding structure to a second base-structure with a circuit and conductive bonding structure, eliminating the need for wire-bonding and simplifying the manufacturing and packaging process, while ensuring a small size and high performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate manufacturing of CMOS circuit and MEMS microphone with wire-bonding is used, then electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the CMOS circuit and MEMS microphone onto a single substrate, eliminating the need for wire-bonding and separate assembly. The microphone component and circuit are integrated in the same package, reducing manufacturing complexity and assembly steps while maintaining reliable electrical connections through direct substrate routing.
2Reliability
If separate manufacturing with wire-bonding is used, then electrical connection is established, but the size of the packaged device increases
Solution Approach 1:
By combining the CMOS circuit and MEMS microphone into a single integrated package on one substrate, the patent eliminates the need for additional wire-bonding space and separate mounting areas. This integration significantly reduces the overall packaged device volume while ensuring reliable electrical connections through substrate-based routing.
3Reliability
If separate manufacturing with wire-bonding is used, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent integrates the CMOS circuit and MEMS microphone manufacturing into a single process flow on one substrate, eliminating costly wire-bonding operations and multiple assembly steps. This unified approach reduces manufacturing complexity, material costs, and labor requirements while maintaining reliable electrical connections through direct substrate routing.
Data Source
AI summary
A micro-electro-mechanical system (MEMS) microphone and a forming method therefore. The MEMS microphone comprises: a first substrate, the first substrate is provided with a first bonding face, the first substrate comprises an MEMS microphone component and a first conductive bonding structure arranged on the first bonding face, a second substrate, the second substrate is provided with a second bonding face, the second bonding substrate comprises a circuit and a second conductive bonding structure arranged on the second bonding face; the first substrate and the second substrate are oppositely fitted together via the first conductive bonding structure and the second conductive bonding structure. Embodiments of the present invention have a simple packaging technique and a compact size; the MEMS microphone packaging structure formed has a great performance on signal-to-noise ratio, and a great anti-interference capability.